EP4SGX360KF43C2N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 880 23105536 353600 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,074 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 880 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SGX360KF43C2N – Stratix® IV GX Field Programmable Gate Array (FPGA) IC 880 I/O 1760-BBGA
The EP4SGX360KF43C2N is an Intel Stratix IV GX field programmable gate array delivered in a 1760‑FBGA package. It provides a high logic capacity device architecture with 353,600 logic elements and approximately 23.1 Mbits of embedded memory to address complex digital designs.
Key physical and electrical attributes include 880 user I/O pins, a 1760‑FCBGA package (42.5 × 42.5 mm), surface‑mount mounting, a core supply range of 870 mV to 930 mV, and commercial operating temperature from 0 °C to 85 °C. The device is RoHS‑compliant and targeted at commercial‑grade systems requiring substantial logic, memory and I/O resources.
Key Features
- Core Logic 353,600 logic elements provide extensive programmable logic capacity for large-scale digital implementations.
- On‑Chip Memory Approximately 23.1 Mbits of embedded RAM to support buffer, cache and data‑path requirements within the FPGA fabric.
- I/O and Packaging 880 user I/O pins in a 1760‑FBGA (1760‑FCBGA, 42.5 × 42.5 mm) package enable high‑density board routing and multiple interface implementations.
- Power and Supply Core voltage supply range of 870 mV to 930 mV for the device core power domain; supports surface‑mount assembly.
- Operating Conditions Commercial grade operation with specified temperature range from 0 °C to 85 °C.
- Standards and Compliance RoHS‑compliant construction; device is documented within the Stratix IV device handbook and datasheet for detailed electrical and timing specifications.
Typical Applications
- High‑density digital processing Use the large logic fabric and embedded RAM for complex state machines, protocol engines and datapath implementations.
- High‑I/O interface systems The 880 I/O pins and FCBGA package support designs that require multiple parallel interfaces or dense connectivity to external devices.
- Memory‑intensive functions Embedded RAM capacity suits buffering, packet handling and on‑chip data storage for systems that rely on substantial local memory.
Unique Advantages
- Large logic capacity: 353,600 logic elements enable implementation of sizable digital systems without immediate need for multiple devices.
- Substantial embedded memory: Approximately 23.1 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and caching tasks.
- High pin count and dense packaging: 880 user I/Os in a 1760‑FCBGA (42.5 × 42.5 mm) form factor provides board‑level flexibility while conserving PCB area.
- Commercial temperature suitability: Specified 0 °C to 85 °C operation aligns with a wide range of commercial electronic applications.
- Controlled core voltage range: 870 mV to 930 mV core supply supports predictable power budgeting for system designs.
- Regulatory compliance: RoHS‑compliant manufacturing supports environmentally regulated product builds.
Why Choose EP4SGX360KF43C2N?
The EP4SGX360KF43C2N positions itself as a high‑capacity Stratix IV GX FPGA option for commercial systems that demand significant logic, embedded memory and large I/O counts in a single device. Its combination of 353,600 logic elements, approximately 23.1 Mbits of on‑chip RAM and 880 I/O pins in a 1760‑FCBGA package supports compact, high‑functionality designs while maintaining commercial temperature operation.
Designed for applications where integration density and predictable electrical characteristics matter, this device is suitable for development teams and procurement organizations seeking a documented Stratix IV FPGA with established datasheet and device handbook support.
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