EP4SGX360KF43C4

The EP4SGX360KF43C4 is a Stratix® IV GX field programmable gate array (FPGA) supplied in a 1760-ball FCBGA package. It provides a high-capacity programmable fabric with 353,600 logic elements, approximately 23.1 Mbits of on-chip RAM, and support for up to 880 I/Os.

Designed for commercial-grade applications, this device offers a combination of large logic capacity, substantial embedded memory, and dense I/O in a surface-mount FCBGA package with a supply voltage range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  353,600 logic elements provide a large programmable resource for complex digital designs and parallel processing implementations.
• Embedded Memory  Approximately 23.1 Mbits of on-chip RAM for buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Density  Up to 880 I/O pins to support wide external connectivity and high pin-count interfaces.
• Package  1760-ball FCBGA package (supplier device package: 1760-FCBGA, 42.5 × 42.5 mm) optimized for surface-mount assembly and compact system integration.
• Power  Core supply voltage specified from 870 mV to 930 mV to match system power-rail planning and power sequencing requirements.
• Operating Range  Commercial operating temperature range of 0 °C to 85 °C for typical enterprise and commercial deployments.
• Compliance  RoHS-compliant component suitable for RoHS-directed product builds.

Typical Applications

• High-density digital processing  Leverage 353,600 logic elements and abundant on-chip RAM for complex algorithm acceleration and parallel data paths.
• Multi-interface systems  Up to 880 I/Os enable designs that require multiple high-pin-count interfaces or extensive sensor and peripheral connectivity.
• Embedded memory buffering  Approximately 23.1 Mbits of embedded RAM supports packet buffering, FIFO storage, and temporary data queues within the FPGA.

Unique Advantages

• Large programmable fabric: The high number of logic elements allows consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial on-chip RAM: Nearly 23.1 Mbits of embedded memory enables internal data staging and reduces dependence on external memory.
• High I/O count: 880 I/Os support complex connectivity requirements and simplify routing for multi-channel designs.
• Compact FCBGA package: The 1760-FCBGA (42.5 × 42.5 mm) provides a dense form factor for space-constrained systems while supporting surface-mount assembly.
• Defined power envelope: A clear core supply range (870–930 mV) aids in power-system design and supply selection.
• Commercial-grade suitability: Specified 0 °C to 85 °C operating range for enterprise and commercial applications with RoHS compliance.

Why Choose EP4SGX360KF43C4?

The EP4SGX360KF43C4 balances high logic density, significant embedded memory, and a large I/O footprint in a single, surface-mount FCBGA package. It is positioned for commercial designs that require extensive programmable resources and internal RAM, with clearly defined power and temperature specifications to support predictable system integration.

This device is well suited to teams building complex digital processing, multi-interface, or memory-buffering solutions that benefit from consolidating functionality into a single FPGA. Its capacity and packaging provide scalability and integration advantages for long-lived commercial products.

Request a quote or submit a procurement inquiry to receive pricing and availability details for EP4SGX360KF43C4. Our team will provide the necessary information to evaluate integration and lead times.