EP4SGX360KF43I3

IC FPGA 880 I/O 1760FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 880 23105536 353600 1760-BBGA, FCBGA

Quantity 313 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O880Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14144Number of Logic Elements/Cells353600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits23105536

Overview of EP4SGX360KF43I3 – Stratix IV GX FPGA, 353,600 logic elements, 1760-FCBGA

The EP4SGX360KF43I3 is a Stratix® IV GX field-programmable gate array (FPGA) device designed for high-density, programmable logic integration. It combines a large logic fabric with substantial embedded memory, abundant I/O, and on-die features documented in the Stratix IV device handbook.

This device is suited to industrial-grade systems that require extensive logic resources, transceiver and DSP capabilities, and operation across a broad temperature range. Its architecture targets applications where integration, configurability, and robust operating conditions are required.

Key Features

  • High-density logic — 353,600 logic elements to implement complex, high-capacity digital designs and custom compute pipelines.
  • Embedded memory — Approximately 23.1 Mbits of on-chip RAM for large buffering, state storage, and data-path acceleration.
  • Abundant I/O — 880 user I/O pins to support multiple interfaces and wide parallel buses for system integration.
  • Transceiver & DSP support (series-level) — The Stratix IV device handbook includes transceiver performance specifications and DSP block specifications for high-speed serial links and hardware-accelerated signal processing.
  • Clocking and PLLs (series-level) — Clock tree and PLL specifications are documented in the device handbook to support flexible timing architectures and multi-clock designs.
  • Configuration and debug — Configuration flow and JTAG functionality are specified in the device documentation for programming and boundary-scan debug.
  • Package and mounting — 1760-FCBGA / 1760-BBGA surface-mount package; supplier package specified as 1760-FCBGA (42.5 × 42.5 mm) for high-density board designs.
  • Supply and temperature — Voltage supply range 870 mV to 930 mV; industrial operating temperature range −40 °C to 100 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • High-speed communications — Transceiver-capable designs that require many I/O and on-chip resources for protocol implementation and serialization/deserialization.
  • Signal processing and DSP acceleration — Hardware-accelerated filtering, transforms, and real-time data-paths leveraging the device’s logic density and documented DSP block specifications.
  • Industrial control and automation — Programmable control, sensor aggregation, and deterministic I/O handling benefitting from the device’s industrial temperature rating and large I/O count.
  • Complex embedded platforms — SoC offload, custom peripherals, and system glue logic where significant embedded memory and logic elements reduce external component count.

Unique Advantages

  • High integration density: 353,600 logic elements and substantial embedded RAM let you consolidate functions that would otherwise require multiple devices.
  • Extensive I/O capability: 880 I/O pins support wide buses, multiple interfaces, and flexible board-level partitioning.
  • Designed for demanding environments: Industrial-grade operating range (−40 °C to 100 °C) enables reliable operation in temperature-challenging installations.
  • Documented system features: The Stratix IV device handbook provides transceiver, PLL, DSP, memory block, and configuration/JTAG specifications to assist in system-level design and verification.
  • Robust packaging: 1760-FCBGA / BBGA packages provide a compact, high-pin-count solution for dense PCB layouts.
  • Regulatory compliance: RoHS compliance supports deployment in regions and projects requiring restricted-substance adherence.

Why Choose EP4SGX360KF43I3?

The EP4SGX360KF43I3 positions itself as a high-density Stratix IV GX FPGA option for designs that demand large programmable logic capacity, significant embedded memory, and extensive I/O. Its documented transceiver, DSP, PLL, and memory block specifications help engineers implement complex, high-performance systems with confidence.

With an industrial temperature range, surface-mount 1760-FCBGA packaging, and a defined supply window, this device offers a combination of integration and robustness appropriate for industrial and high-performance embedded applications where long-term scalability and design flexibility matter.

Request a quote or submit an inquiry to receive pricing and availability information for EP4SGX360KF43I3 and to discuss how it can fit into your next high-density FPGA design.

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