EP4SGX360KF43I4N

The EP4SGX360KF43I4N is a Stratix® IV GX field programmable gate array (FPGA) IC from Intel. It delivers a high-capacity programmable logic fabric with integrated on-chip memory and a large complement of I/O for complex system designs.

Designed for applications that require substantial logic resources, embedded memory and dense I/O, this device balances integration and ruggedness with an industrial temperature rating and surface-mount FCBGA packaging.

Key Features

• Programmable Logic  Provides 353,600 logic elements organized across 14,144 CLBs for implementing complex custom logic and control functions.
• Embedded Memory  Includes approximately 23.1 Mbits of on-chip RAM to support buffering, state storage and memory-intensive algorithms without external memory for many functions.
• High-Density I/O  Offers 880 user I/O pins to accommodate multiple high-speed interfaces, parallel buses and extensive peripheral connectivity.
• Power and Voltage  Operates with a core supply range of 870 mV to 930 mV, enabling designers to plan power distribution and regulator selection precisely.
• Package and Mounting  Supplied in a 1760-FCBGA package (42.5 × 42.5 mm) with surface-mount mounting for compact, board-level integration.
• Industrial Grade and Temperature Range  Rated for industrial use with an operating temperature range of −40°C to 100°C, supporting deployment in challenging environments.
• Compliance  RoHS compliant to meet common environmental and supply-chain requirements.

Typical Applications

• Industrial Control  Programmable logic and industrial temperature rating make this FPGA suitable for control systems and factory automation where robust operation is required.
• High-Density I/O Systems  With 880 I/O pins, the device supports boards that require many parallel interfaces, sensor arrays or multi-protocol connectivity.
• Embedded Processing and Acceleration  Large logic capacity and on-chip memory allow implementation of custom accelerators, data path logic and preprocessing functions directly in the FPGA fabric.
• Prototyping and System Integration  Surface-mount FCBGA packaging and extensive resources enable compact, production-like prototypes and integration into final products.

Unique Advantages

• High Logic Capacity: 353,600 logic elements provide the headroom for complex designs and large-scale integration of custom logic blocks.
• Substantial On-Chip Memory: Approximately 23.1 Mbits of embedded RAM reduces dependence on external memory for many buffering and state storage needs.
• Extensive Connectivity: 880 I/O pins support multiple interfaces and high channel counts without extensive board-level multiplexing.
• Industrial Reliability: Industrial grade rating and −40°C to 100°C operating range enable use in temperature-challenging environments.
• Compact, Surface-Mount Package: 1760-FCBGA (42.5 × 42.5 mm) packaging supports dense PCB layouts and standard surface-mount assembly processes.
• Regulatory Compliance: RoHS compliant to align with environmental compliance requirements.

Why Choose EP4SGX360KF43I4N?

The EP4SGX360KF43I4N positions itself where high logic capacity, significant embedded memory and large I/O density are required within an industrial-temperature FPGA. Its combination of 353,600 logic elements, approximately 23.1 Mbits of on-chip RAM and 880 I/Os makes it suitable for designs that integrate numerous interfaces and heavy custom logic without excessive external components.

This device is appropriate for teams and projects seeking a highly integrated FPGA solution in a compact FCBGA package, particularly where industrial-grade temperature tolerance and RoHS compliance are important considerations.

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