EP4SGX360NF45C2
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 920 23105536 353600 1932-BBGA, FCBGA |
|---|---|
| Quantity | 272 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 920 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SGX360NF45C2 – Stratix® IV GX FPGA, 353,600 Logic Elements, 1932-BBGA FCBGA
The EP4SGX360NF45C2 is a Stratix IV GX field programmable gate array (FPGA) in a 1932-ball FCBGA package designed for high-density, high-I/O applications. The device provides a large programmable fabric with 353,600 logic elements and approximately 23.1 Mbits of embedded memory, combined with family-level features such as high-speed transceivers, DSP blocks, and extensive I/O capability.
This commercial-grade, surface-mount FPGA supports a broad set of system-level uses where high logic capacity, large on-chip RAM, and dense I/O are required. Key electrical and environmental parameters include a nominal core supply window of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C.
Key Features
- High Logic Capacity 353,600 logic elements enable complex, high-density designs and large processing pipelines.
- Logic Block Count 14,144 logic blocks (as provided in device data) for structured mapping of logic and resources.
- Embedded Memory Approximately 23.1 Mbits of on-chip RAM for buffers, FIFOs, and memory-intensive functions.
- I/O Density 920 I/O pins support wide, parallel interfaces and dense board-level connectivity.
- Package and Mounting 1932-BBGA (FCBGA), supplier device package 1932-FBGA, FC (45×45); surface-mount mounting for compact system integration.
- Power and Supply Core supply range specified from 870 mV to 930 mV to match system power-rail design requirements.
- Operating Range and Grade Commercial grade operation with operating temperature 0 °C to 85 °C and RoHS-compliant construction.
- Stratix IV Family Capabilities Datasheet references indicate family-level features including high-speed transceiver support, DSP blocks, PLLs and clock networks, external memory interface capability, and signal-integrity/diagnostic features.
Typical Applications
- High-speed communications Family-level high-speed transceiver features and 920 I/Os suit dense interface implementations and protocol bridging.
- Digital signal processing Large logic fabric and embedded memory support DSP pipelines and video or signal-processing accelerators referenced in the device family documentation.
- Memory interface and controller design On-chip RAM and documented external memory interface features enable controller prototyping and integration.
- Complex system integration High logic count and extensive I/O accommodate system aggregation, glue logic, and custom hardware functions.
Unique Advantages
- High processing capacity: The 353,600 logic elements provide substantial headroom for complex logic, algorithm acceleration, and large state machines.
- Large on‑chip memory: Approximately 23.1 Mbits of embedded RAM reduces dependence on external memory for many buffering and intermediate-storage needs.
- Extensive I/O count: 920 I/Os allow direct connection to multiple peripherals, buses, and high-pin-count interfaces without extensive serialization.
- Compact system footprint: 1932-ball FCBGA packaging in a 45×45 format supports high-density board designs while maintaining surface-mount assembly compatibility.
- Family-level system features: The Stratix IV family documentation highlights transceivers, DSP resources, PLLs, and diagnostic/signal-integrity capabilities to help address high-bandwidth and complex design requirements.
- Clear electrical and thermal spec window: Defined core voltage range (870 mV–930 mV) and commercial operating temperature (0 °C–85 °C) aid power-supply and thermal planning.
Why Choose EP4SGX360NF45C2?
The EP4SGX360NF45C2 positions itself for designs that demand very high logic density, significant embedded memory, and a large number of I/Os in a compact FCBGA package. Backed by the Stratix IV GX family architecture and documented family-level features—such as high-speed transceivers and DSP resources—this device is suitable for engineers implementing dense, performance-oriented FPGA solutions within commercial operating conditions.
Choose this FPGA when your project requires a combination of large programmable fabric, on-chip memory capacity, and high I/O count, with defined power and temperature parameters to support reliable deployment and system integration.
Request a quote or submit an inquiry for pricing and availability to begin specifying EP4SGX360NF45C2 for your next design.

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