EP4SGX360NF45C2

IC FPGA 920 I/O 1932FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 920 23105536 353600 1932-BBGA, FCBGA

Quantity 272 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O920Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14144Number of Logic Elements/Cells353600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits23105536

Overview of EP4SGX360NF45C2 – Stratix® IV GX FPGA, 353,600 Logic Elements, 1932-BBGA FCBGA

The EP4SGX360NF45C2 is a Stratix IV GX field programmable gate array (FPGA) in a 1932-ball FCBGA package designed for high-density, high-I/O applications. The device provides a large programmable fabric with 353,600 logic elements and approximately 23.1 Mbits of embedded memory, combined with family-level features such as high-speed transceivers, DSP blocks, and extensive I/O capability.

This commercial-grade, surface-mount FPGA supports a broad set of system-level uses where high logic capacity, large on-chip RAM, and dense I/O are required. Key electrical and environmental parameters include a nominal core supply window of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

  • High Logic Capacity  353,600 logic elements enable complex, high-density designs and large processing pipelines.
  • Logic Block Count  14,144 logic blocks (as provided in device data) for structured mapping of logic and resources.
  • Embedded Memory  Approximately 23.1 Mbits of on-chip RAM for buffers, FIFOs, and memory-intensive functions.
  • I/O Density  920 I/O pins support wide, parallel interfaces and dense board-level connectivity.
  • Package and Mounting  1932-BBGA (FCBGA), supplier device package 1932-FBGA, FC (45×45); surface-mount mounting for compact system integration.
  • Power and Supply  Core supply range specified from 870 mV to 930 mV to match system power-rail design requirements.
  • Operating Range and Grade  Commercial grade operation with operating temperature 0 °C to 85 °C and RoHS-compliant construction.
  • Stratix IV Family Capabilities  Datasheet references indicate family-level features including high-speed transceiver support, DSP blocks, PLLs and clock networks, external memory interface capability, and signal-integrity/diagnostic features.

Typical Applications

  • High-speed communications  Family-level high-speed transceiver features and 920 I/Os suit dense interface implementations and protocol bridging.
  • Digital signal processing  Large logic fabric and embedded memory support DSP pipelines and video or signal-processing accelerators referenced in the device family documentation.
  • Memory interface and controller design  On-chip RAM and documented external memory interface features enable controller prototyping and integration.
  • Complex system integration  High logic count and extensive I/O accommodate system aggregation, glue logic, and custom hardware functions.

Unique Advantages

  • High processing capacity: The 353,600 logic elements provide substantial headroom for complex logic, algorithm acceleration, and large state machines.
  • Large on‑chip memory: Approximately 23.1 Mbits of embedded RAM reduces dependence on external memory for many buffering and intermediate-storage needs.
  • Extensive I/O count: 920 I/Os allow direct connection to multiple peripherals, buses, and high-pin-count interfaces without extensive serialization.
  • Compact system footprint: 1932-ball FCBGA packaging in a 45×45 format supports high-density board designs while maintaining surface-mount assembly compatibility.
  • Family-level system features: The Stratix IV family documentation highlights transceivers, DSP resources, PLLs, and diagnostic/signal-integrity capabilities to help address high-bandwidth and complex design requirements.
  • Clear electrical and thermal spec window: Defined core voltage range (870 mV–930 mV) and commercial operating temperature (0 °C–85 °C) aid power-supply and thermal planning.

Why Choose EP4SGX360NF45C2?

The EP4SGX360NF45C2 positions itself for designs that demand very high logic density, significant embedded memory, and a large number of I/Os in a compact FCBGA package. Backed by the Stratix IV GX family architecture and documented family-level features—such as high-speed transceivers and DSP resources—this device is suitable for engineers implementing dense, performance-oriented FPGA solutions within commercial operating conditions.

Choose this FPGA when your project requires a combination of large programmable fabric, on-chip memory capacity, and high I/O count, with defined power and temperature parameters to support reliable deployment and system integration.

Request a quote or submit an inquiry for pricing and availability to begin specifying EP4SGX360NF45C2 for your next design.

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