EP4SGX360KF43I3N

The EP4SGX360KF43I3N is a Stratix® IV GX field programmable gate array (FPGA) IC from Intel supplied in a 1760-FCBGA package. It offers high logic density and substantial on-chip memory with a broad I/O complement, making it suitable for industrial applications that require configurable digital logic and large embedded memory resources.

Key Features

• Core Logic  353,600 logic elements provide substantial programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 23.1 Mbits of embedded memory to support buffering, lookup tables, and local data storage.
• I/O Capacity  880 general-purpose I/O pins to support wide parallel interfaces and high-pin-count system integration.
• Power  Operates from a supply range of 870 mV to 930 mV for core power delivery requirements.
• Package  1760-BBGA / 1760-FCBGA package (supplier device package: 1760-FCBGA, 42.5 × 42.5 mm) for compact, surface-mount board-level integration.
• Thermal and Environmental  Industrial-grade operating range from −40 °C to 100 °C and RoHS-compliant construction for regulatory and environmental considerations.

Typical Applications

• High-density signal processing  Large logic capacity and embedded memory make the device suitable for implementing complex digital signal processing pipelines.
• Communications and networking  The combination of high logic count and 880 I/Os supports wide parallel interfaces and system-level packet processing tasks.
• Industrial control and automation  Industrial temperature rating and extensive I/O allow deployment in control systems requiring robust, reprogrammable logic.
• Hardware prototyping and acceleration  Substantial on-chip resources enable hardware acceleration and prototyping of compute-intensive functions.

Unique Advantages

• High logic density: 353,600 logic elements let designers implement large-scale combinational and sequential logic on a single device, reducing board count.
• Significant embedded memory: Approximately 23.1 Mbits of on-chip RAM supports buffering and on-chip data storage, minimizing external memory needs.
• Extensive I/O: 880 I/Os provide flexibility for interfacing with numerous peripherals, sensors, and parallel buses.
• Industrial temperature range: Rated from −40 °C to 100 °C for deployment in industrial environments with wide thermal swings.
• Compact FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) offers dense integration in surface-mount PCB designs.
• RoHS-compliant: Environmentally compliant manufacturing meets common regulatory requirements.

Why Choose EP4SGX360KF43I3N?

The EP4SGX360KF43I3N combines high logic element count, sizable embedded memory, and a large I/O complement in a compact 1760-FCBGA package, making it a strong option for complex, reprogrammable digital systems in industrial settings. Its core voltage range and industrial operating temperature support robust deployment where reliable operation across temperature and power conditions is required.

Designed and manufactured by Intel, this Stratix® IV GX FPGA variant is suited for engineering teams developing high-density digital designs that require on-chip memory, extensive interfacing, and long-term board-level integration.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the EP4SGX360KF43I3N.