EP4SGX360KF43C4N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 880 23105536 353600 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,165 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 880 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SGX360KF43C4N – Stratix® IV GX Field Programmable Gate Array (FPGA), 1760-FCBGA
The EP4SGX360KF43C4N is a Stratix® IV GX field programmable gate array (FPGA) in a 1760-FCBGA surface-mount package. It provides a high-density programmable logic fabric with 353,600 logic elements, approximately 23.1 Mbits of embedded memory, and 880 I/O pins for complex digital designs.
Designed for commercial applications, the device operates from a core supply range of 870 mV to 930 mV and across a 0 °C to 85 °C temperature range. The package and electrical characteristics suit dense board layouts and high-channel I/O requirements.
Key Features
- Core Logic Approximately 353,600 logic elements for implementing large-scale custom logic and control functions.
- Embedded Memory Approximately 23.1 Mbits of on-chip RAM to support buffering, lookup tables, and data processing without relying solely on external memory.
- I/O Capacity 880 general-purpose I/O pins to accommodate wide parallel interfaces, multi-channel connectivity, and high-pin-count peripherals.
- Power Core supply voltage specified between 870 mV and 930 mV to match targeted power-rail designs.
- Package & Mounting 1760-FCBGA (42.5 × 42.5 mm) surface-mount package (1760-BBGA, FCBGA) for compact, board-level integration.
- Operating Range & Grade Commercial-grade device rated for 0 °C to 85 °C operation.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High-density logic integration: Enables consolidation of large amounts of custom logic—reducing external components and simplifying system architecture.
- Substantial on-chip memory: Approximately 23.1 Mbits of embedded RAM helps minimize external memory requirements for buffering and data-processing tasks.
- Extensive I/O footprint: 880 I/O pins provide flexibility for complex interfacing, wide buses, and multi-channel signal routing.
- Compact FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) supports dense PCB layouts while maintaining a high pin-count footprint.
- Defined power envelope: Clear core voltage range (870–930 mV) simplifies power-supply planning and margin analysis.
- Regulatory alignment for commercial use: RoHS compliance and commercial temperature grading support standard commercial product lines.
Why Choose EP4SGX360KF43C4N?
The EP4SGX360KF43C4N positions itself as a high-density Stratix® IV GX FPGA option for designers requiring large logic capacity, significant on-chip memory, and a high number of I/O channels in a compact FCBGA package. Its specified voltage range and commercial temperature grading make it appropriate for demanding commercial electronic systems where integration and I/O scalability are priorities.
This device is suited to teams and projects that need to consolidate complex digital functions onto a single programmable device while managing board space and external component count. The combination of logic resources, embedded RAM, and I/O capacity provides a scalable platform for advanced FPGA-based designs.
Request a quote or submit an inquiry for pricing and availability of EP4SGX360KF43C4N.

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