EP4SGX360KF43C4N

IC FPGA 880 I/O 1760FCBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 880 23105536 353600 1760-BBGA, FCBGA

Quantity 1,165 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O880Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14144Number of Logic Elements/Cells353600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits23105536

Overview of EP4SGX360KF43C4N – Stratix® IV GX Field Programmable Gate Array (FPGA), 1760-FCBGA

The EP4SGX360KF43C4N is a Stratix® IV GX field programmable gate array (FPGA) in a 1760-FCBGA surface-mount package. It provides a high-density programmable logic fabric with 353,600 logic elements, approximately 23.1 Mbits of embedded memory, and 880 I/O pins for complex digital designs.

Designed for commercial applications, the device operates from a core supply range of 870 mV to 930 mV and across a 0 °C to 85 °C temperature range. The package and electrical characteristics suit dense board layouts and high-channel I/O requirements.

Key Features

  • Core Logic  Approximately 353,600 logic elements for implementing large-scale custom logic and control functions.
  • Embedded Memory  Approximately 23.1 Mbits of on-chip RAM to support buffering, lookup tables, and data processing without relying solely on external memory.
  • I/O Capacity  880 general-purpose I/O pins to accommodate wide parallel interfaces, multi-channel connectivity, and high-pin-count peripherals.
  • Power  Core supply voltage specified between 870 mV and 930 mV to match targeted power-rail designs.
  • Package & Mounting  1760-FCBGA (42.5 × 42.5 mm) surface-mount package (1760-BBGA, FCBGA) for compact, board-level integration.
  • Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • High-density logic integration: Enables consolidation of large amounts of custom logic—reducing external components and simplifying system architecture.
  • Substantial on-chip memory: Approximately 23.1 Mbits of embedded RAM helps minimize external memory requirements for buffering and data-processing tasks.
  • Extensive I/O footprint: 880 I/O pins provide flexibility for complex interfacing, wide buses, and multi-channel signal routing.
  • Compact FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) supports dense PCB layouts while maintaining a high pin-count footprint.
  • Defined power envelope: Clear core voltage range (870–930 mV) simplifies power-supply planning and margin analysis.
  • Regulatory alignment for commercial use: RoHS compliance and commercial temperature grading support standard commercial product lines.

Why Choose EP4SGX360KF43C4N?

The EP4SGX360KF43C4N positions itself as a high-density Stratix® IV GX FPGA option for designers requiring large logic capacity, significant on-chip memory, and a high number of I/O channels in a compact FCBGA package. Its specified voltage range and commercial temperature grading make it appropriate for demanding commercial electronic systems where integration and I/O scalability are priorities.

This device is suited to teams and projects that need to consolidate complex digital functions onto a single programmable device while managing board space and external component count. The combination of logic resources, embedded RAM, and I/O capacity provides a scalable platform for advanced FPGA-based designs.

Request a quote or submit an inquiry for pricing and availability of EP4SGX360KF43C4N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up