EP4SGX360NF45C3

The EP4SGX360NF45C3 is a Stratix® IV GX field programmable gate array (FPGA) in a 1932-ball FCBGA package. It provides high-density programmable logic resources and a large complement of I/O for designs that require significant on-chip logic and interfacing capacity.

With 353,600 logic elements, approximately 23.1 Mbits of embedded memory and up to 920 I/Os, this device is suited for applications that demand extensive parallel logic, on-chip RAM and broad external connectivity while operating within a commercial temperature range.

Key Features

• Core Logic  353,600 logic elements and 14,144 CLBs provide extensive programmable logic capacity for complex designs.
• Embedded Memory  Approximately 23.1 Mbits of on-chip RAM to support large buffering, state storage and memory-intensive functions.
• I/O Capacity  Up to 920 I/O pins enable wide external connectivity and multi-channel interfacing options.
• Package and Mounting  1932-BBGA (FCBGA) package in a 45 × 45 mm supplier device package; surface-mount mounting type for compact board-level integration.
• Power  Specified core voltage range of 870 mV to 930 mV for device operation.
• Temperature and Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance  RoHS compliant for lead-free manufacturing requirements.

Typical Applications

• High-density digital systems  Large logic element count supports complex parallel processing and custom digital functions on a single device.
• Multi-channel I/O processing  Up to 920 I/Os allow aggregation and control of numerous external interfaces and signals.
• Memory-intensive logic  Approximately 23.1 Mbits of embedded RAM is suitable for designs that require substantial on-chip buffering or local storage.
• Compact board-level integration  Surface-mount FCBGA packaging enables space-efficient placement in systems where board real estate matters.

Unique Advantages

• High logic density: 353,600 logic elements deliver the capacity to implement large-scale custom logic without partitioning across multiple FPGAs.
• Substantial embedded memory: Approximately 23.1 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage needs.
• Extensive I/O count: 920 I/Os simplify system-level integration by supporting multiple channels and interfaces directly from the FPGA.
• Compact FCBGA package: 1932-ball FCBGA in a 45 × 45 mm footprint supports high-density board designs while maintaining surface-mount assembly compatibility.
• Low-voltage core operation: Core supply range of 870 mV to 930 mV aligns with low-voltage FPGA power domains.
• Commercial temperature grade: Rated for 0 °C to 85 °C for typical commercial applications and deployments.

Why Choose EP4SGX360NF45C3?

The EP4SGX360NF45C3 combines a very large logic fabric, significant embedded memory and a high I/O count in a compact FCBGA package. This balance of resources makes it a practical choice for engineers building dense, I/O-rich systems that require substantial on-chip logic and memory.

Designed for commercial-grade applications, the device provides a clear specification set for power, thermal range and packaging that supports straightforward system integration and assembly while meeting RoHS requirements.

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