EP4SGX360NF45C4G

The EP4SGX360NF45C4G is a high-capacity FPGA device from Intel, documented in the Stratix IV Device Handbook. It combines a large programmable logic fabric with extensive embedded memory and a high I/O count to address demanding digital designs.

Designed for applications that require substantial logic resources, high aggregate data bandwidth and flexible I/O integration, this surface-mount FCBGA device delivers a balance of logic density, on-chip memory and packaging suitable for commercial-temperature systems.

Key Features

• Logic Capacity — 353,600 logic elements provide substantial programmable logic resources for complex designs and parallel processing.
• Embedded Memory — Approximately 23.1 Mbits of on-chip RAM to support large buffering, frame storage and local data manipulation without relying solely on external memory.
• I/O Density — 920 I/O pins to support wide external connectivity, parallel interfaces and multi-channel designs.
• Device Architecture (Documented) — Features described in the Stratix IV Device Handbook such as high-speed transceiver support, DSP blocks, clock networks and PLLs for system-level integration.
• Package & Mounting — Supplied in a 1932-FBGA (45×45) / 1932-BBGA FCBGA package, optimized for surface-mount PCB assembly and dense system layouts.
• Power — Core voltage range specified at 870 mV to 930 mV for operation within the device’s recommended supply window.
• Temperature & Grade — Commercial grade operation from 0 °C to 85 °C for standard commercial product deployments.
• Environmental Compliance — RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• High-speed communications and networking — Implement protocol processing and high aggregate bandwidth data paths using the device architecture and high I/O count described in the Stratix IV documentation.
• Signal processing and DSP acceleration — Large logic capacity and embedded memory enable on-chip DSP implementation and local buffering for real-time processing.
• Memory interface controllers — On-chip resources and architecture support designs that integrate with external memory interfaces and manage high-bandwidth transfers.

Unique Advantages

• High logic density: 353,600 logic elements provide headroom for complex algorithms, pipelines and parallel compute blocks.
• Significant on-chip RAM: Approximately 23.1 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
• Extensive external connectivity: 920 I/Os enable broad interfacing options with sensors, transceivers and peripheral subsystems.
• Compact system footprint: 1932-FBGA / FCBGA package supports dense board designs while maintaining a surface-mount assembly flow.
• Commercial-ready thermal range: Specified for 0 °C to 85 °C operation, suitable for standard commercial applications and deployments.
• Compliance-ready: RoHS compliance aligns with common lead-free manufacturing requirements.

Why Choose EP4SGX360NF45C4G?

The EP4SGX360NF45C4G positions itself for designs that require a combination of high logic capacity, substantial embedded memory and broad I/O integration within a compact FCBGA package. Referenced in the Stratix IV Device Handbook, the device’s architecture supports system-level features such as high-speed transceiver capability, DSP resources and comprehensive clocking and PLL options.

This device is well suited to development teams and OEMs building commercial-temperature systems that need scalable programmable logic, on-chip memory to reduce external BOM, and high-density connectivity for complex peripherals and high-bandwidth data paths.

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