EP4SGX360NF45I4

The EP4SGX360NF45I4 is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1932-BBGA FCBGA package and intended for surface-mount assembly. It provides high-density programmable logic and extensive I/O connectivity for demanding embedded and industrial applications.

With 353,600 logic elements, approximately 23.1 Mbits of embedded memory, and 920 user I/Os, this device targets designs that require large logic capacity, abundant on-chip RAM, and broad connectivity while operating over an industrial temperature range.

Key Features

• Logic Capacity  353,600 logic elements for large-scale integration and complex logic implementation.
• Embedded Memory  Approximately 23.1 Mbits of on-chip RAM to support buffering, packet processing, and intermediate data storage.
• I/O and Connectivity  920 user I/Os to enable extensive peripheral and high-pin-count interfacing.
• Transceivers and DSP Blocks (Documented)  Stratix IV device documentation includes transceiver and DSP block specifications for designs requiring high-speed serial links and signal processing—refer to the Stratix IV device handbook for details.
• Configuration and Debug  Configuration and JTAG specifications are provided in the Stratix IV device handbook to support programming and debug flows.
• Power Supply  Core voltage supply range specified at 870 mV to 930 mV, enabling designs optimized around the device’s low-voltage core.
• Package & Mounting  1932-BBGA (FCBGA) package, supplier device package 1932-FBGA, FC (45×45), supplied for surface-mount PCB assembly.
• Industrial Temperature Range  Rated for operation from –40°C to 100°C and specified as Industrial grade for application environments requiring extended temperature support.

Typical Applications

• High-density logic systems  Large logic element count and abundant I/Os support complex control, glue-logic, and integration tasks in high-performance embedded systems.
• Signal processing and DSP  On-chip memory and documented DSP block specifications make the device suitable for DSP-centric tasks such as filtering, transforms, and real-time data manipulation.
• Communications and networking equipment  Transceiver and high I/O capacity documented in the device handbook are applicable to equipment that requires high-speed links and extensive port interfacing.
• Industrial automation and control  Industrial-grade temperature range and robust packaging support deployment in factory automation and industrial control systems.

Unique Advantages

• High logic density: 353,600 logic elements reduce the need for multiple devices, simplifying board-level integration and lowering BOM complexity.
• Significant embedded memory: Approximately 23.1 Mbits of on-chip RAM enable local buffering and reduce external memory dependence for many designs.
• Extensive I/O resources: 920 user I/Os provide the flexibility to connect numerous peripherals, sensors, and high-pin-count interfaces without external expanders.
• Industrial readiness: Rated for –40°C to 100°C and designated Industrial grade for reliable operation in temperature-challenging environments.
• Documented subsystem capabilities: The Stratix IV device handbook includes detailed specifications for transceivers, PLLs, DSP blocks, and configuration/JTAG to support system-level design and verification.
• Compact package: 1932-BBGA FCBGA packaging delivers high pin density in a compact footprint suitable for space-constrained boards.

Why Choose EP4SGX360NF45I4?

The EP4SGX360NF45I4 offers a combination of very high logic capacity, substantial embedded memory, and a large number of I/Os in a compact FCBGA package, making it well suited to complex embedded, communications, and industrial designs that demand integration and scalability. Its documented transceiver, DSP, PLL, and configuration capabilities in the Stratix IV device handbook provide the technical detail engineers need to implement advanced signal processing and high-speed interfaces.

This device is appropriate for customers designing systems that require robust operation across an industrial temperature range, dense on-chip resources to minimize external components, and the documented subsystem support needed to accelerate development and verification.

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