EP4SGX360NF45I4N

The EP4SGX360NF45I4N is a Stratix® IV GX field programmable gate array (FPGA) in a 1932-BBGA FCBGA package designed for surface-mount assembly. It integrates a large programmable fabric with 353,600 logic elements, approximately 23.1 Mbits of on-chip RAM, and up to 920 user I/O to support high-density, high-capacity digital designs.

Targeted for industrial applications, this device combines extensive logic and memory resources with a broad operating temperature range and a defined core supply range to support robust embedded designs and complex system integration.

Key Features

• FPGA Core Stratix® IV GX field programmable gate array architecture provided in the EP4SGX360NF45I4N part.
• Logic Capacity 353,600 logic elements enabling large, deeply pipelined or highly parallel logic implementations.
• Logic Blocks 14,144 logic blocks to structure logic resources for complex designs.
• Embedded Memory Approximately 23.1 Mbits of total on-chip RAM for buffering, FIFOs, and on-chip data storage.
• I/O Density Up to 920 user I/O pins available for broad peripheral, bus, and parallel interface support.
• Power and Voltage Core voltage supply specified from 870 mV to 930 mV for defined power domain design and supply sequencing.
• Package and Mounting 1932-BBGA (FCBGA, supplier package 1932-FBGA, FC 45×45) suitable for surface-mount assembly in compact, high-pin-count applications.
• Operating Range Industrial temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Regulatory Compliance RoHS compliant.

Typical Applications

• Industrial Control Systems Use the industrial temperature rating and extensive I/O to interface sensors, actuators, and fieldbus networks in factory or process automation.
• High-Density Data Processing Leverage 353,600 logic elements and approximately 23.1 Mbits of on-chip RAM for data aggregation, real-time processing, and protocol bridging.
• Prototyping and System Integration High logic and I/O counts enable integration of multiple subsystems onto a single FPGA for rapid prototyping and system consolidation.

Unique Advantages

• Large, Scalable Logic Fabric: 353,600 logic elements support extensive custom logic, parallelism, and complex algorithm implementation.
• Significant On-Chip Memory: Approximately 23.1 Mbits of embedded RAM reduce external memory dependency and improve deterministic performance.
• High I/O Count: 920 user I/O pins allow direct interfacing to a wide range of peripherals and multiple parallel buses without extensive external logic.
• Industrial Temperature Rating: Specified −40 °C to 100 °C operation supports deployment in harsh or outdoor industrial environments.
• Compact High-Pin Package: The 1932-BBGA FCBGA package delivers high pin count in a compact footprint suitable for dense board designs.
• Defined Core Supply Range: Core voltage specification (870 mV–930 mV) helps ensure predictable power design and integration with regulated power rails.

Why Choose EP4SGX360NF45I4N?

The EP4SGX360NF45I4N balances large programmable logic capacity, substantial embedded memory, and very high I/O density within a compact 1932-BBGA package. Its industrial operating range and RoHS compliance make it a practical choice for long-life embedded systems that require significant on-chip resources.

This device is well suited to engineers and system designers building consolidated, high-capacity digital subsystems, industrial controllers, and prototypes that demand a combination of logic scale, memory, and extensive interfacing capability.

Request a quote or contact sales to discuss availability, lead times, and pricing for EP4SGX360NF45I4N. Our team can assist with ordering and technical questions to help you integrate this Stratix® IV GX FPGA into your design.