EP4SGX360NF45I4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,725 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 920 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SGX360NF45I4G – Field Programmable Gate Array (FPGA) IC
The EP4SGX360NF45I4G is an Intel Stratix IV family field programmable gate array (FPGA) device optimized for high-density logic and on-chip memory integration. The device combines a large logic fabric with extensive I/O and high-speed transceiver capability from the Stratix IV GX device family to address demanding data and signal-processing designs.
Typical use cases include high-speed communications, complex digital signal processing, and systems requiring large amounts of programmable logic and embedded memory while operating across an industrial temperature range.
Key Features
- FPGA Core: Provides 353,600 logic elements, delivering large-scale programmable logic capacity suitable for complex designs.
- Embedded Memory: Approximately 23 Mbits of on-chip RAM (23,105,536 total RAM bits) for buffering, lookup tables, and memory-intensive algorithms.
- I/O and Connectivity: Up to 920 user I/O pins to support broad interface requirements; device family documentation also highlights high-speed transceiver and external memory interface capabilities.
- Package and Mounting: Supplied in a 1932-ball FBGA package (1932-BBGA / 45×45 FCBGA footprint) for surface-mount assembly.
- Power Supply: Core voltage supply range from 870 mV to 930 mV to meet the device’s specified operating window.
- Industrial Operating Range: Rated for operation from −40 °C to 100 °C and specified as Industrial grade for elevated environment requirements.
- Standards Compliance: RoHS compliant, supporting environmentally regulated assembly and manufacturing requirements.
- Documented Architecture: Part of the Stratix IV device family with published device handbook and architecture references for system integration and design planning.
Typical Applications
- High‑Speed Communications: Leverage high-speed transceiver features and extensive I/O to implement multi‑lane serial links and protocol bridging.
- Digital Signal Processing: Large logic capacity and embedded memory enable complex DSP pipelines and real‑time data manipulation.
- External Memory Interfaces: Use abundant I/O and on-chip resources for memory controller implementations and high-throughput external memory connectivity.
- System Integration & Prototyping: High logic density and documented device features support integration of custom accelerators, glue logic, and system-level prototyping.
Unique Advantages
- Large Logic Capacity: 353,600 logic elements enable integration of complex functions on a single device, reducing board-level component count.
- Significant On‑Chip Memory: Approximately 23 Mbits of embedded memory supports buffering, large LUTs, and state storage without external RAM.
- Extensive I/O Resources: 920 I/O pins provide flexibility for multi-interface designs and high‑pin‑count subsystems.
- Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in thermally demanding environments.
- Compact High‑Ball‑Count Package: 1932‑ball FCBGA enables a dense implementation footprint for space-constrained PCBs while maintaining high pin count.
- Documented Device Family: Stratix IV family handbook and related material provide architecture-level guidance for design and integration.
Why Choose EP4SGX360NF45I4G?
The EP4SGX360NF45I4G is positioned for designs that require substantial programmable logic, sizable on‑chip memory, and broad I/O connectivity within an industrial operating range. Its combination of 353,600 logic elements, approximately 23 Mbits of embedded memory, and 920 I/O pins makes it suitable for demanding communications, signal processing, and system‑level integration tasks.
With packaging optimized for high pin count and RoHS compliance, this device offers a balanced platform for engineering teams seeking a documented Stratix IV family solution backed by device handbook resources for development and deployment.
Request a quote or submit a pricing request to obtain availability and volume pricing for EP4SGX360NF45I4G.

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