EP4SGX530HH35C2G

The EP4SGX530HH35C2G is an Intel (Altera) Stratix IV series FPGA device. It delivers a high-density programmable fabric intended for compute- and I/O-intensive embedded designs within commercial temperature environments.

With a large logic capacity, substantial on‑chip RAM, and a high I/O count, this device is suited for applications requiring extensive logic integration, memory resources, and flexible interfacing. The part balances integration and performance while operating from a low core voltage range.

Key Features

• Core Architecture  Stratix IV device family features and architecture as documented in the Stratix IV Device Handbook.
• Logic Capacity  531,200 logic elements to implement large, complex designs and system-level functions.
• Embedded Memory  Approximately 28 Mbits of embedded memory (28,033,024 total RAM bits) for buffering, frame storage, and on‑chip data structures.
• I/O Density  564 user I/O pins to support wide external interfacing and high connector/channel counts.
• Packaging & Mounting  1152-ball FCBGA package; supplier device package listed as 1152-HBGA (42.5 × 42.5 mm). Surface-mount mounting type.
• Power  Core voltage supply range of 870 mV to 930 mV to match low-voltage power domains.
• Operating Range & Grade  Commercial grade device rated for 0°C to 85°C operation.
• Series-Level I/O and Transceiver Features  Stratix IV family documentation highlights high-speed transceiver capabilities, wide protocol support, and external memory interface support (refer to the Stratix IV Device Handbook for series details).
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-performance networking  Implement packet processing, protocol bridging, and wide I/O interface logic that leverage the device's high logic count and dense I/O.
• Data processing and signal aggregation  On‑chip RAM and large logic resources support buffering, aggregation, and custom processing pipelines.
• External memory interfacing  Use the device's memory resources and available I/O to implement controllers and interfaces for external DRAM or parallel memory buses.
• Accelerators and DSP functions  Stratix IV family features enable implementation of DSP and custom acceleration blocks within the programmable fabric.

Unique Advantages

• High logic density: 531,200 logic elements provide room for complex system logic and large-scale integration on a single device.
• Substantial on‑chip memory: Approximately 28 Mbits of embedded RAM reduces dependence on external memory for many buffering and state‑storage needs.
• Extensive I/O capability: 564 I/O pins enable rich external connectivity and support for multi-channel interfaces.
• Compact, production-ready package: 1152-ball FCBGA (supplier 1152-HBGA, 42.5 × 42.5 mm) offers a dense mounting footprint for board-level designs.
• Low-voltage core operation: 870–930 mV supply range aligns with modern low-voltage power architectures to help optimize system power design.
• Commercial temperature rating: 0°C to 85°C operation for mainstream embedded and communications equipment.

Why Choose EP4SGX530HH35C2G?

The EP4SGX530HH35C2G positions itself as a high-density Stratix IV FPGA option for designs that require large programmable logic, significant on‑chip memory, and broad I/O capability within a commercial temperature envelope. Its combination of 531,200 logic elements, approximately 28 Mbits of embedded RAM, and 564 I/Os makes it suitable for integration-heavy applications such as networking, data processing, and accelerator implementations.

Designed to be integrated on surface-mount PCBs in a 1152-ball FCBGA package and operated from a low core voltage, this device provides a balanced platform for customers seeking scalability, extensive I/O, and the documented architecture features of the Stratix IV family.

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