EP4SGX530HH35C3

The EP4SGX530HH35C3 is a Stratix® IV GX Field Programmable Gate Array (FPGA) from Intel, delivered in a high-density FCBGA package. It provides 531,200 logic elements and approximately 28.03 Mbits of embedded memory to address complex, high-capacity digital designs.

With 564 I/Os, a compact 1152-BBGA/1152-HBGA package option, and a supply voltage range of 870 mV to 930 mV, this commercial-grade FPGA is suited to designs that require substantial logic resources and high pin counts while operating in standard commercial temperature ranges.

Key Features

• Logic Capacity — 531,200 logic elements for implementing large-scale digital logic and custom processing blocks.
• Embedded Memory — Approximately 28.03 Mbits of on-chip RAM to support buffering, packet storage, and temporary data structures without external memory.
• I/O Density — 564 I/O pins to enable broad connectivity and interfacing with multiple peripheral devices or parallel buses.
• Power Supply — Nominal operating supply range of 870 mV to 930 mV for core power planning.
• Package and Mounting — 1152-BBGA, FCBGA package case; supplier device package specified as 1152-HBGA (42.5x42.5). Surface-mount device for PCB assembly.
• Operating Grade — Commercial-grade device with operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High-density logic implementations — Use the large pool of logic elements to implement complex custom logic, state machines, and parallel processing tasks.
• On-chip memory-dependent designs — Leverage approximately 28.03 Mbits of embedded RAM for buffering, FIFOs, and temporary data storage to reduce external memory requirements.
• High I/O interfacing — 564 I/Os enable integration with multiple peripherals, wide parallel buses, or multi-channel I/O requirements.

Unique Advantages

• Substantial logic resources: 531,200 logic elements provide the capacity needed for large-scale, highly parallel designs.
• Significant embedded memory: Approximately 28.03 Mbits of on-chip RAM helps minimize external memory and simplify board-level design.
• High I/O count: 564 I/Os give designers flexibility for dense interfacing and multicore or multi-channel connectivity.
• Compact, surface-mount packaging: 1152-BBGA/1152-HBGA packaging supports high-density PCB layouts while maintaining a standard surface-mount assembly process.
• Commercial operating range: Rated for 0 °C to 85 °C to match typical commercial system requirements.
• RoHS compliant: Meets common environmental compliance expectations for modern electronics manufacturing.

Why Choose EP4SGX530HH35C3?

The EP4SGX530HH35C3 positions itself as a high-capacity Stratix® IV GX FPGA option for designs that demand extensive logic, abundant embedded memory, and a large number of I/Os in a compact surface-mount package. Its combination of 531,200 logic elements, approximately 28.03 Mbits of on-chip RAM, and 564 I/Os supports consolidation of system functions onto a single device to reduce board complexity.

Manufactured by Intel and offered in a 1152-BBGA/1152-HBGA package with RoHS compliance, this commercial-grade FPGA is appropriate for development teams and procurement looking for a proven, high-density programmable logic solution backed by established vendor documentation.

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