EP4SGX530HH35C3N

The EP4SGX530HH35C3N is a Stratix® IV GX Field Programmable Gate Array (FPGA) offered in a 1152-BBGA FCBGA package. It provides a high logic element count and substantial on-chip memory, along with a large number of I/O pins and a low-voltage core supply range, suitable for dense programmable logic implementations.

With 531,200 logic elements and approximately 28 Mbits of embedded memory, this device targets designs requiring significant logic capacity, abundant I/O connectivity, and compact surface-mount packaging.

Key Features

• Core Capacity 531,200 logic elements to support large, complex digital designs.
• Embedded Memory Approximately 28 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Density 564 general-purpose I/O pins to accommodate multiple interfaces and high-pin-count system connections.
• Power Core voltage supply range: 870 mV to 930 mV, enabling operation within a defined low-voltage envelope.
• Package & Mounting 1152-BBGA (FCBGA) surface-mount package; supplier device package listed as 1152-HBGA with a 42.5 × 42.5 mm footprint for compact board-level integration.
• Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory RoHS compliant.

Typical Applications

• High-density digital systems — Use the large logic element count to implement complex custom logic, state machines, and protocol processing.
• I/O-intensive interface bridging — Leverage 564 I/O pins to connect multiple peripherals, buses, or transceiver interfaces on a single device.
• On-chip buffering and local memory processing — Approximately 28 Mbits of embedded RAM supports data buffering, FIFOs, and local scratch memory for processing pipelines.

Unique Advantages

• High logic capacity: 531,200 logic elements enable implementation of large-scale programmable logic functions without external logic expansion.
• Substantial on-chip memory: Approximately 28 Mbits of embedded RAM reduces the need for external memory for many buffering and intermediate-storage needs.
• Extensive I/O availability: 564 I/O pins simplify integration of multiple interfaces and high-pin-count subsystems.
• Compact, surface-mount package: 1152-BBGA FCBGA in a 42.5 × 42.5 mm footprint provides a dense board-level solution for space-constrained designs.
• Defined low-voltage core operation: Core supply from 870 mV to 930 mV supports designs optimized for low-voltage logic domains.
• Commercial-grade compliance and RoHS: Commercial temperature grading and RoHS compliance support mainstream electronic product development and manufacturing.

Why Choose EP4SGX530HH35C3N?

The EP4SGX530HH35C3N positions itself as a high-capacity Stratix IV GX FPGA option for designs that require large programmable logic resources, significant embedded memory, and extensive I/O connectivity in a compact surface-mount package. Its combination of 531,200 logic elements, roughly 28 Mbits of on-chip RAM, and 564 I/O pins makes it suitable for complex, integration-focused FPGA implementations.

Engineers and procurement teams seeking a commercial-grade FPGA with a balance of logic density, memory, and I/O in a 1152-BBGA package will find this device applicable for systems that prioritize on-chip resources and board-level integration.

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