EP4SGX530HH35I3

IC FPGA 564 I/O 1152HBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 28033024 531200 1152-BBGA, FCBGA

Quantity 306 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-HBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SGX530HH35I3 – Stratix IV GX FPGA, 531,200 logic elements, 564 I/Os, 1152-BBGA

The EP4SGX530HH35I3 is a Stratix IV GX field-programmable gate array (FPGA) from Intel, built for high-density, high-throughput designs. It combines a large logic fabric with substantial embedded memory and a high I/O count to address demanding communications, networking, and high-performance signal processing applications.

Designed as an industrial-grade device, the part offers a broad operating temperature range, low-voltage core supply, and a compact 1152-ball BGA package for system integration where board space and thermal margins are important.

Key Features

  • Core Capacity — 531,200 logic elements provide substantial programmable logic resources for complex designs and large-scale integration.
  • Embedded Memory — Approximately 28 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
  • I/O Density — 564 I/O pins to support wide external connectivity and multi-channel interfaces.
  • Package and Mounting — 1152-BBGA (FCBGA) package; supplier device package listed as 1152-HBGA with a 42.5 × 42.5 mm footprint; surface-mount mounting type for automated PCB assembly.
  • Power — Core voltage supply range of 870 mV to 930 mV for the device core.
  • Temperature Range — Industrial operating temperature from −40 °C to 100 °C for deployment in challenging environments.
  • Industry Compliance — RoHS compliant.
  • Family-Level Capabilities — Datasheet identifies Stratix IV GX family features such as high-speed transceiver functionality, DSP blocks, PLLs, extensive clock networks, and support for a wide range of protocols and high aggregate data bandwidth.

Typical Applications

  • Telecommunications and Networking — High I/O count and family-level high-speed transceiver features suit multi-channel line cards, packet processing, and protocol handling.
  • Data Center and High-Speed Interfaces — Large logic capacity and significant embedded memory enable implementation of complex packet buffering, switching, and custom accelerator functions.
  • Video and Signal Processing — Dense logic resources and on-chip RAM support real-time processing, video pipelines, and DSP-oriented designs.
  • Test & Measurement — High I/O density and industrial temperature rating make the device suitable for instrumentation requiring flexible, high-performance FPGA processing.

Unique Advantages

  • High Logic Integration: 531,200 logic elements enable integration of extensive custom logic and multiple subsystems into a single device, reducing BOM and board complexity.
  • Substantial Embedded Memory: Approximately 28 Mbits of on-chip RAM provides local storage for buffering, state machines, and data-path acceleration without external memory dependence.
  • Comprehensive I/O: 564 I/Os accommodate broad connectivity options and interface diversity, simplifying system-level routing of multiple channels and peripherals.
  • Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in industrial and harsh-environment systems.
  • Compact BGA Package: 1152-ball BGA (42.5 × 42.5 mm supplier footprint) balances high pin count with a manageable PCB footprint for dense system designs.
  • Family-Level High-Speed Features: Stratix IV GX family characteristics—documented transceiver, DSP, and clocking capabilities—support high-bandwidth, protocol-rich applications.

Why Choose EP4SGX530HH35I3?

The EP4SGX530HH35I3 positions itself for designs that require extensive logic resources, significant on-chip memory, and a high I/O count within an industrial temperature envelope. Its Stratix IV GX family characteristics provide architectural building blocks—transceivers, DSP blocks, and robust clocking—that help implement high-throughput, protocol-aware systems while minimizing external component needs.

Choose this part when your design demands scalable logic capacity, dependable operation from −40 °C to 100 °C, and a compact high-density package for system integration. The combination of core voltage specification, RoHS compliance, and the documented family features supports long-term deployment in demanding communications, processing, and instrumentation applications.

Request a quote or submit an inquiry to receive pricing and availability information for EP4SGX530HH35I3 and to discuss how this FPGA can fit your next high-performance design.

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