EP4SGX530HH35I3
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 28033024 531200 1152-BBGA, FCBGA |
|---|---|
| Quantity | 306 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-HBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530HH35I3 – Stratix IV GX FPGA, 531,200 logic elements, 564 I/Os, 1152-BBGA
The EP4SGX530HH35I3 is a Stratix IV GX field-programmable gate array (FPGA) from Intel, built for high-density, high-throughput designs. It combines a large logic fabric with substantial embedded memory and a high I/O count to address demanding communications, networking, and high-performance signal processing applications.
Designed as an industrial-grade device, the part offers a broad operating temperature range, low-voltage core supply, and a compact 1152-ball BGA package for system integration where board space and thermal margins are important.
Key Features
- Core Capacity — 531,200 logic elements provide substantial programmable logic resources for complex designs and large-scale integration.
- Embedded Memory — Approximately 28 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
- I/O Density — 564 I/O pins to support wide external connectivity and multi-channel interfaces.
- Package and Mounting — 1152-BBGA (FCBGA) package; supplier device package listed as 1152-HBGA with a 42.5 × 42.5 mm footprint; surface-mount mounting type for automated PCB assembly.
- Power — Core voltage supply range of 870 mV to 930 mV for the device core.
- Temperature Range — Industrial operating temperature from −40 °C to 100 °C for deployment in challenging environments.
- Industry Compliance — RoHS compliant.
- Family-Level Capabilities — Datasheet identifies Stratix IV GX family features such as high-speed transceiver functionality, DSP blocks, PLLs, extensive clock networks, and support for a wide range of protocols and high aggregate data bandwidth.
Typical Applications
- Telecommunications and Networking — High I/O count and family-level high-speed transceiver features suit multi-channel line cards, packet processing, and protocol handling.
- Data Center and High-Speed Interfaces — Large logic capacity and significant embedded memory enable implementation of complex packet buffering, switching, and custom accelerator functions.
- Video and Signal Processing — Dense logic resources and on-chip RAM support real-time processing, video pipelines, and DSP-oriented designs.
- Test & Measurement — High I/O density and industrial temperature rating make the device suitable for instrumentation requiring flexible, high-performance FPGA processing.
Unique Advantages
- High Logic Integration: 531,200 logic elements enable integration of extensive custom logic and multiple subsystems into a single device, reducing BOM and board complexity.
- Substantial Embedded Memory: Approximately 28 Mbits of on-chip RAM provides local storage for buffering, state machines, and data-path acceleration without external memory dependence.
- Comprehensive I/O: 564 I/Os accommodate broad connectivity options and interface diversity, simplifying system-level routing of multiple channels and peripherals.
- Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in industrial and harsh-environment systems.
- Compact BGA Package: 1152-ball BGA (42.5 × 42.5 mm supplier footprint) balances high pin count with a manageable PCB footprint for dense system designs.
- Family-Level High-Speed Features: Stratix IV GX family characteristics—documented transceiver, DSP, and clocking capabilities—support high-bandwidth, protocol-rich applications.
Why Choose EP4SGX530HH35I3?
The EP4SGX530HH35I3 positions itself for designs that require extensive logic resources, significant on-chip memory, and a high I/O count within an industrial temperature envelope. Its Stratix IV GX family characteristics provide architectural building blocks—transceivers, DSP blocks, and robust clocking—that help implement high-throughput, protocol-aware systems while minimizing external component needs.
Choose this part when your design demands scalable logic capacity, dependable operation from −40 °C to 100 °C, and a compact high-density package for system integration. The combination of core voltage specification, RoHS compliance, and the documented family features supports long-term deployment in demanding communications, processing, and instrumentation applications.
Request a quote or submit an inquiry to receive pricing and availability information for EP4SGX530HH35I3 and to discuss how this FPGA can fit your next high-performance design.

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