EP4SGX530HH35I3N

The EP4SGX530HH35I3N is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC designed for high-density digital integration. It delivers substantial programmable logic capacity and on-chip memory for complex custom logic, data buffering, and system integration tasks.

With a large number of I/O pins, a broad operating temperature range, and a compact surface-mount package, this device is suited for industrial-grade embedded systems and other applications that require high logic density and extensive interfacing.

Key Features

• Core Logic Capacity — 531,200 logic elements to implement complex programmable logic and large-scale digital designs.
• Embedded Memory — Approximately 28 Mbits of total on-chip RAM for data buffering, packet processing, and state storage.
• I/O Resources — 564 user I/O pins to support wide-ranging interfacing and parallel connectivity.
• Power — Specifies a core supply voltage range of 870 mV to 930 mV for core power planning.
• Package & Mounting — Available in a 1152‑BBGA FCBGA package; supplier device package listed as 1152‑HBGA (42.5 × 42.5 mm). Surface-mount mounting type.
• Operating Range — Industrial-grade device rated for operation from −40 °C to 100 °C.
• Standards Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Implement complex custom logic and system-on-chip functions using the device’s 531,200 logic elements and substantial embedded RAM.
• I/O‑intensive interfaces — Support multi-channel or parallel interfacing requirements with 564 available I/O pins.
• Industrial embedded equipment — Deploy in industrial environments that require operation across −40 °C to 100 °C and surface-mount packaging.
• Memory-centric acceleration — Use the approximately 28 Mbits of on-chip RAM for buffering, packet processing, or latency‑sensitive data paths.

Unique Advantages

• High logic capacity: 531,200 logic elements enable complex algorithm implementation and large-scale integration on a single device.
• Significant embedded memory: Approximately 28 Mbits of on-chip RAM reduces dependence on external memory for many buffering and temporary-storage tasks.
• Extensive I/O: 564 I/O pins support broad connectivity options for multi-channel and parallel interfaces.
• Industrial operating range: Rated from −40 °C to 100 °C for robust performance in temperature-varying environments.
• Compact surface-mount package: 1152‑BBGA FCBGA footprint with supplier package reference 1152‑HBGA (42.5 × 42.5 mm) for space-conscious board designs.
• Regulatory compliance: RoHS compliant to meet environmental and manufacturing requirements.

Why Choose EP4SGX530HH35I3N?

The EP4SGX530HH35I3N positions itself as a high-capacity FPGA option for designs that demand large programmable logic resources, extensive on-chip memory, and significant I/O. Its industrial temperature rating and surface-mount FCBGA packaging make it suitable for embedded systems that require both density and environmental robustness.

Designers and procurement teams looking for a scalable, high-density programmable device can leverage this FPGA to consolidate logic, reduce external memory needs, and support complex interfacing within a single, RoHS-compliant package.

Request a quote or submit a procurement inquiry for EP4SGX530HH35I3N to receive pricing and availability details tailored to your project requirements.