EP4SGX530HH35C4N

The EP4SGX530HH35C4N is a Stratix® IV GX field-programmable gate array (FPGA) from Intel, supplied in a 1152-BBGA (FCBGA) package. It delivers a high logic density device with extensive on-chip memory and a large I/O count for demanding, board-level digital designs.

Built for commercial applications, this device combines 531,200 logic elements, approximately 28 Mbits of embedded memory, and 564 I/O pins, offering a platform for complex custom logic, high-density integration, and designs that require broad connectivity and scalable on-chip resources.

Key Features

• Core Logic  531,200 logic elements provide substantial capacity for building complex finite-state machines, datapaths, and custom accelerators.
• Embedded Memory  Approximately 28 Mbits of on-chip RAM to support buffering, large lookup tables, and local data storage without external memory.
• High I/O Count  564 I/O pins enable broad external interfacing options for multi-channel systems and dense board-level connectivity.
• Power Supply  Operates from a supply range of 870 mV to 930 mV, allowing precise power budgeting and system-level power planning.
• Package & Mounting  Available in a 1152-BBGA, FCBGA package (supplier device package: 1152-HBGA, 42.5 × 42.5 mm) and intended for surface-mount assembly.
• Operating Conditions  Commercial-grade device specified for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant for lead-free manufacturing and regulatory considerations.

Typical Applications

• High-density digital systems  Use the large logic element count and embedded memory to implement complex custom logic and multi-function FPGA designs.
• Multi-channel I/O platforms  Leverage 564 I/O pins for systems requiring extensive external connectivity or parallel interfaces.
• On-board accel­eration and buffering  Take advantage of approximately 28 Mbits of embedded RAM for local data storage, packet buffering, or temporary datasets.

Unique Advantages

• High logic density: 531,200 logic elements let you consolidate functions into a single device and reduce BOM count.
• Significant on-chip memory: Approximately 28 Mbits of embedded RAM reduces reliance on external memory, simplifying board design and lowering latency.
• Extensive I/O resources: 564 I/O pins provide flexibility for interfacing to many peripherals, sensors, or parallel data channels.
• Compact, manufacturable package: 1152-BBGA (FCBGA) form factor and surface-mount mounting support standard PCB assembly flows for commercial products.
• RoHS compliant: Supports lead-free production and environmental requirements.

Why Choose EP4SGX530HH35C4N?

The EP4SGX530HH35C4N positions itself as a high-capacity, commercially graded FPGA for designs that require substantial logic resources, abundant embedded memory, and wide-ranging I/O. Its combination of 531,200 logic elements, approximately 28 Mbits of on-chip RAM, and 564 I/O pins provides a flexible platform for consolidating complex digital functions onto a single device.

This device is suited to engineers and procurement teams developing board-level systems that prioritize integration density, on-chip memory bandwidth, and broad connectivity within a commercial temperature range. Its packaging and RoHS compliance support standard surface-mount manufacturing and regulatory needs.

Request a quote or submit your requirements to receive pricing and availability for the EP4SGX530HH35C4N.