EP4SGX530HH35C3NES
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 28033024 531200 1152-BBGA, FCBGA |
|---|---|
| Quantity | 719 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-HBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530HH35C3NES – Stratix® IV GX FPGA, 531,200 logic elements, 564 I/O, 1152-BBGA
The EP4SGX530HH35C3NES is a Stratix® IV GX field-programmable gate array (FPGA) from Intel, offering very high logic density and on-chip memory for demanding digital designs. It is built on the Stratix IV GX device family architecture and is targeted at applications that require substantial logic capacity, large embedded RAM, and high I/O counts.
This commercial-grade device provides a combination of logic capacity, approximately 28 Mbits of embedded memory, and 564 I/O pins in a compact 1152-BBGA FCBGA package—suitable for high-bandwidth communications, signal processing, and system integration roles where board-level surface-mount deployment is required.
Key Features
- High logic capacity — 531,200 logic elements (cells) to implement large, complex FPGA designs and integration of multiple functions on a single device.
- On-chip memory — Approximately 28 Mbits of embedded RAM for buffering, frame storage, and intermediate data processing without external memory.
- I/O density — 564 general-purpose I/O pins to support multiple external interfaces and dense board-level connectivity.
- Stratix IV GX family capabilities — Series-level features described in the device handbook include high-speed transceiver support, DSP blocks, PLLs, and advanced clock networks for high-bandwidth designs.
- Package and mounting — 1152-BBGA, FCBGA surface-mount package (supplier designation: 1152-HBGA, 42.5 × 42.5 mm) for compact, board-ready integration.
- Power rails — Core supply range specified at 870 mV to 930 mV for the device core voltage domain.
- Commercial temperature grade — Rated for 0 °C to 85 °C operation, suitable for commercial applications and environments.
- RoHS compliant — Meets RoHS requirements for lead-free manufacturing and环保 compliance.
Typical Applications
- High‑performance networking and communications — Large logic capacity and series-level high-speed transceiver features support packet processing, switching, and protocol handling in bandwidth‑intensive designs.
- Digital signal processing — Substantial embedded RAM and Stratix IV DSP resources enable filtering, FFTs, and real‑time signal chains without extensive external memory.
- External memory interface controllers — On‑chip resources and clocking features support complex external memory interfaces and memory controller implementations.
- System integration and prototyping — High I/O count and dense logic fabric allow consolidation of multiple board‑level functions into a single programmable device for rapid system development.
Unique Advantages
- Large single‑chip integration: 531,200 logic elements reduce the need for multiple devices, lowering BOM and board complexity.
- Significant on‑chip memory: Approximately 28 Mbits of embedded RAM cuts dependence on external memory for many buffering and storage tasks.
- High I/O scalability: 564 I/O pins provide flexibility to interface with numerous peripherals and high‑density connectors.
- Compact, surface‑mount package: 1152-BBGA FCBGA (42.5 × 42.5 mm) offers a space-efficient footprint for production PCBs.
- Power-aware core voltage: 870–930 mV core supply range supports low-voltage core operation consistent with high-density FPGA architectures.
- Documented family features: As a Stratix IV GX device, it is supported by device handbook content covering transceivers, DSP blocks, PLLs, and clock networks to aid system design.
Why Choose EP4SGX530HH35C3NES?
The EP4SGX530HH35C3NES positions itself as a high‑density Stratix IV GX FPGA offering a balance of large logic capacity, substantial embedded memory, and high I/O count in a production-ready surface-mount package. Its commercial temperature rating and defined core voltage range make it suitable for complex digital systems where integration and deterministic behavior are priorities.
This device is appropriate for engineering teams and system designers focused on high‑bandwidth communications, advanced signal processing, and consolidation of multiple functions onto a single FPGA. Backed by the Stratix IV device documentation, it provides the technical grounding needed for scalable designs and long‑term product development.
Request a quote or submit an inquiry to obtain pricing, availability, and support for the EP4SGX530HH35C3NES for your next design.

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