EP4SGX530HH35C3ES

The EP4SGX530HH35C3ES is a Stratix IV GX field-programmable gate array (FPGA) IC from Intel, delivered in a 1152-BBGA / FCBGA package. It combines a high logic element count with substantial on-chip RAM and a large I/O complement for complex, high-integration designs.

Targeted at commercial electronic systems, this FPGA is suitable for applications that require dense logic, significant embedded memory, and extensive I/O connectivity while operating within a commercial temperature range.

Key Features

• High Logic Capacity  Provides 531,200 logic elements to implement complex digital designs and system-level integration.
• Embedded Memory  Approximately 28 Mbits of on-chip RAM (28,033,024 total RAM bits) for frame buffering, FIFOs, and large local data storage.
• Generous I/O  564 user I/O pins to support wide-ranging peripheral and interface requirements.
• Stratix IV GX Family  Part of the Stratix IV GX family with device handbook documentation covering device core, transceiver, memory, DSP, and clocking architecture.
• Power and Voltage  Core voltage supply range specified at 870 mV to 930 mV to match system power-rail requirements.
• Commercial Grade and Temperature  Commercial-grade device rated for 0 °C to 85 °C operation.
• Package and Mounting  1152-BBGA, FCBGA package; supplier device package listed as 1152-HBGA (42.5 × 42.5). Surface-mount mounting type for board-level integration.
• Standards Compliance  RoHS-compliant component for regulatory alignment in commercial products.

Typical Applications

• High-speed communications  Leverages the Stratix IV GX family architecture and extensive I/O to implement protocol engines and packet processing functions.
• Signal processing and DSP  Large logic capacity and approximately 28 Mbits of embedded memory support complex DSP pipelines and buffering.
• System integration and prototyping  High logic density and abundant I/O enable consolidation of multiple functions onto a single FPGA for rapid development and system-level validation.

Unique Advantages

• High integration density: 531,200 logic elements enable consolidation of multiple subsystems and reduce the need for external glue logic.
• Significant on-chip memory: Approximately 28 Mbits of embedded RAM reduces reliance on external memory for many buffering and caching tasks.
• Extensive I/O resources: 564 I/O pins support complex interfacing, multiple parallel buses, and mixed-signal front-ends.
• Compact surface-mount package: 1152-BBGA / 1152-HBGA (42.5 × 42.5) packaging delivers a high-pin-count solution in a board-friendly form factor.
• Commercial readiness: Commercial temperature grading (0 °C to 85 °C) and RoHS compliance simplify integration into mainstream products.
• Documented family architecture: Inclusion in the Stratix IV GX device handbook provides reference material covering core features, transceivers, memory, DSP blocks, and clocking resources.

Why Choose EP4SGX530HH35C3ES?

The EP4SGX530HH35C3ES offers a balance of very high logic density, substantial embedded memory, and large I/O capacity in a commercial-grade Stratix IV GX FPGA package. Its documented family architecture supports designs that require dense logic implementation, significant on-chip buffering, and broad interfacing capability.

This part is well suited to engineering teams developing high-integration commercial systems who need a proven device family and clear device-level documentation. The combination of logic resources, memory, and I/O supports scalable designs and helps streamline system-level integration.

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