EP4SGX530HH35C4
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 28033024 531200 1152-BBGA, FCBGA |
|---|---|
| Quantity | 951 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-HBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530HH35C4 – Stratix® IV GX FPGA, 531,200 logic elements, 1152-BBGA
The EP4SGX530HH35C4 is a Stratix IV GX field-programmable gate array (FPGA) offered by Intel (Altera), built on the Stratix IV device family architecture. It pairs large programmable fabric with high I/O density and device-level features described in the Stratix IV device handbook.
This device targets applications that require high aggregate data bandwidth, extensive on-chip memory and logic capacity, and a broad set of I/O resources — delivering a balance of integration and performance for demanding digital designs within a commercial temperature range.
Key Features
- Logic Capacity 531,200 logic elements provide substantial programmable fabric for complex logic, control, and datapath implementations.
- Embedded Memory Approximately 28 Mbits of on-chip RAM to support buffering, frame storage, and intermediate data structures.
- I/O Density 564 I/O pins enable broad external connectivity for high-pin-count interfaces and multi-channel systems.
- High-Speed Architecture (Series Features) Part of the Stratix IV GX family, which includes device-level features such as high-speed transceiver support, wide protocol capability, and high aggregate data bandwidth as described in the device handbook.
- Clocking and DSP Support (Series Features) Stratix IV series architecture includes dedicated clock networks, PLLs, and DSP resources to support synchronous designs and signal processing tasks.
- Power Specified core supply voltage range of 870 mV to 930 mV for the device core.
- Package and Mounting 1152-BBGA (FCBGA) package with supplier device package noted as 1152-HBGA (42.5×42.5); surface-mount mounting type for board-level integration.
- Commercial Grade and Temperature Commercial grade device with an operating temperature range of 0°C to 85°C.
- RoHS Compliance RoHS-compliant device suitable for designs requiring restricted-substance conformity.
Typical Applications
- High-bandwidth Networking Equipment Large logic capacity, abundant I/O, and Stratix IV GX series transceiver and bandwidth features support packet processing, switching, and protocol handling.
- Data Processing and Acceleration The combination of extensive logic elements and approximately 28 Mbits of on-chip RAM enables buffering and pipelined datapaths for custom acceleration tasks.
- Video and Broadcast Systems High I/O count and embedded memory are well suited to multi-channel video interfaces, frame buffering, and real-time processing pipelines.
- Test & Measurement Flexible programmable fabric and dense I/O support complex signal conditioning, timing, and control logic required in instrumentation platforms.
Unique Advantages
- Large Programmable Fabric: 531,200 logic elements enable complex algorithms, state machines, and high-parallelism datapaths without external logic.
- Significant Embedded Memory: Approximately 28 Mbits of on-chip RAM reduces dependence on external memory for many buffering and working-data needs.
- High I/O Count: 564 I/Os provide flexibility to connect multiple high-speed interfaces and parallel channels directly to the FPGA.
- Package Density for Compact Designs: 1152-BBGA (FCBGA) / 1152-HBGA (42.5×42.5) packaging delivers high pin count in a compact surface-mount form factor.
- Low-Voltage Core: Core supply range of 870 mV–930 mV aligns with modern low-voltage system designs.
- Documented Series Architecture: Part of the Stratix IV family, with device handbook references for architecture, transceivers, clocking, and system integration details.
Why Choose EP4SGX530HH35C4?
The EP4SGX530HH35C4 delivers a combination of high logic capacity, substantial embedded memory, and broad I/O connectivity in a commercial-grade Stratix IV GX FPGA package. These characteristics make it appropriate for designs that require sustained data throughput, extensive parallel processing, and multiple external interfaces.
Engineers choosing this device benefit from the documented Stratix IV device family architecture and on-chip resources that support complex datapaths, memory-intensive functions, and multi-channel I/O while operating within a commercial temperature range and RoHS compliance.
Request a quote or submit a purchase inquiry to receive pricing and availability for EP4SGX530HH35C4.

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