EP4SGX530HH35C2N

The EP4SGX530HH35C2N is a Stratix® IV GX field-programmable gate array (FPGA) IC from Intel, delivered in a 1152-BBGA FCBGA surface-mount package. It is a high-density programmable logic device designed to support complex, resource-intensive designs.

With 531,200 logic elements, approximately 28.0 Mbits of on-chip RAM, 564 I/O pins and a supplier device package dimension of 42.5 × 42.5 mm, this commercial-grade, RoHS-compliant FPGA is suited for applications that require large logic capacity, substantial embedded memory and high I/O integration within a single surface-mount package.

Key Features

• Logic Capacity  531,200 logic elements provide large-scale programmable logic resources for complex designs; the device reports 21,248 logic blocks for partitioning and architectural mapping.
• Embedded Memory  Approximately 28.0 Mbits of on-chip RAM enable extensive buffering, on-chip data storage and state retention without external memory in many designs.
• I/O Density & Packaging  564 I/O pins in a surface-mount 1152-BBGA (FCBGA) package deliver broad external connectivity while maintaining a compact board footprint; supplier package specified as 1152-HBGA (42.5 × 42.5 mm).
• Power Supply Range  Designed to operate with a core voltage supply in the range of 870 mV to 930 mV, enabling targeted power-rail integration in system designs.
• Commercial Grade & Temperature Range  Commercial-grade device with an operating temperature range of 0 °C to 85 °C, suitable for standard commercial electronics environments.
• Compliance  RoHS-compliant status supports regulatory requirements for hazardous-substance reduction in electronic assemblies.

Typical Applications

• High-density logic designs  For designs that require extensive programmable logic resources, the device’s 531,200 logic elements and 21,248 logic blocks enable implementation of complex state machines and large-scale digital functions.
• On-chip buffering and data paths  Approximately 28.0 Mbits of embedded RAM support significant on-chip data storage for buffering, FIFOs and intermediate data processing without immediate need for external memory.
• I/O-intensive systems  With 564 I/O pins, the device is suited for systems needing broad external connectivity and multiple parallel interfaces within a single FPGA package.
• Compact system integration  The 1152-BBGA surface-mount package (supplier package 1152-HBGA, 42.5 × 42.5 mm) enables high integration density on modern PCBs while preserving routing resources.

Unique Advantages

• Large programmable fabric: The combination of 531,200 logic elements and 21,248 logic blocks supports extensive logic partitioning and complex design implementations.
• Substantial on-chip memory: Approximately 28.0 Mbits of embedded RAM reduces dependency on external memory for many buffering and data-path applications, simplifying BOM and board layout.
• High I/O count in a compact package: 564 I/Os in a 1152-BBGA surface-mount footprint provides broad connectivity while conserving board space.
• Controlled power rail window: A defined core voltage range of 870 mV to 930 mV aids predictable power-supply design and integration into existing power architectures.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS-compliant, the device fits standard commercial electronic product requirements.

Why Choose EP4SGX530HH35C2N?

The EP4SGX530HH35C2N delivers a combination of high logic capacity, significant embedded memory and substantial I/O density in a single surface-mount FPGA package from Intel. Its defined voltage range, commercial temperature rating and RoHS compliance make it a practical choice for complex digital designs where integration density and on-chip resources are primary considerations.

This FPGA is suited to design teams and integrators needing scalable programmable logic resources with a focus on high on-chip memory and extensive external connectivity, offering long-term design flexibility within Intel’s Stratix IV GX family framework.

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