EP4SGX530HH35C2

The EP4SGX530HH35C2 is a Stratix IV GX field programmable gate array (FPGA) in a 1152-BBGA surface-mount package. It provides a high-density programmable fabric and on-chip resources tailored for designs requiring large logic capacity, substantial embedded memory, and extensive I/O connectivity.

Typical use cases include high-bandwidth digital systems and platform-level integration where a combination of logic density, embedded memory, and I/O count supports complex signal processing, protocol bridging, and system integration tasks.

Key Features

• Logic Capacity — 531,200 logic elements, enabling large-scale digital designs and complex control or processing functions.
• Embedded Memory — Approximately 28 Mbits of on-chip RAM (28,033,024 bits) to support buffering, packet memory and local data storage needs.
• I/O Connectivity — 564 I/O pins, providing extensive external interface options for multi-channel systems and dense board-level routing.
• Device Architecture — Stratix IV GX family architecture with documented features such as DSP blocks, clock networks and PLLs as described in the device handbook.
• Package and Mounting — 1152-BBGA (FCBGA) package; supplier device package listed as 1152-HBGA (42.5 × 42.5 mm) for compact, high-pin-count board layouts. Surface-mount mounting type.
• Power — Core supply operating range from 870 mV to 930 mV for the device core rail.
• Operating Temperature and Grade — Commercial grade, specified for 0 °C to 85 °C operation.
• Compliance — RoHS compliant.

Typical Applications

• High‑Bandwidth Data Processing — On-chip memory and large logic capacity make the device suitable for buffering and processing wide data streams.
• Protocol Bridging and Interface Aggregation — High I/O count supports multiple interfaces and signal domains for aggregation or protocol conversion tasks.
• DSP and Signal Conditioning — Architecture features described in the device handbook (DSP blocks and clock networks) support complex signal processing pipelines.
• System Integration — Dense logic and embedded memory enable integration of control, preprocessing, and glue logic into a single FPGA device.

Unique Advantages

• High Logic Density: 531,200 logic elements allow implementation of extensive logic functions and large state machines without partitioning across multiple devices.
• Substantial On‑Chip Memory: Approximately 28 Mbits of embedded RAM reduces external memory dependence for many buffering and temporary storage needs.
• Extensive I/O Resources: 564 I/Os provide flexibility for multi-channel designs and high interface-count applications, simplifying board-level routing and integration.
• Compact High‑Pin Package: 1152-BBGA / 1152-HBGA (42.5 × 42.5 mm) options deliver high pin density in a compact footprint for space-constrained systems.
• Low‑Voltage Core Operation: Core supply range of 870 mV to 930 mV supports modern low-voltage system architectures.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation for standard commercial deployments.

Why Choose EP4SGX530HH35C2?

The EP4SGX530HH35C2 positions itself as a high-density Stratix IV GX FPGA offering a combination of large logic resources, substantial embedded memory and a high I/O count in a compact BGA package. Its architecture—documented in the Stratix IV device handbook—includes DSP capabilities, clock networks and PLLs that support complex signal processing and system integration tasks.

This device is suitable for development teams and engineers building high-bandwidth and multi-interface systems that benefit from consolidating logic, memory and I/O into a single programmable device. The commercial-grade rating, RoHS compliance and low-voltage core operation support standard production environments and modern power architectures.

Request a quote or submit a purchase inquiry today to check availability and lead times for EP4SGX530HH35C2. Our team can provide pricing and order details to assist your design and procurement process.