EP4SGX360NF45I3N

The EP4SGX360NF45I3N is a Stratix IV GX Field Programmable Gate Array (FPGA) manufactured by Intel. It provides a large logic capacity and substantial embedded memory in a high-density ball grid array package for complex, programmable hardware designs.

With 353,600 logic elements, approximately 23.1 Mbits of embedded memory and 920 I/O pins, this device is suited to applications that require extensive on-chip logic, wide I/O connectivity and operation across an industrial temperature range.

Key Features

• Logic Capacity  Contains 353,600 logic elements to implement large-scale programmable logic, custom datapaths and complex state machines.
• Embedded Memory  Approximately 23.1 Mbits of on-chip RAM to support buffering, local storage and intermediate data processing without external memory.
• I/O Density  920 I/O pins provide broad connectivity for parallel interfaces, high-pin-count peripherals and multi-channel designs.
• Power Range  Operates from a supply voltage range of 870 mV to 930 mV to match specified system power rails.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Package and Mounting  1932-BBGA FCBGA (supplier package: 1932-FBGA, FC 45×45) in a surface-mount form factor for compact, high-density board designs.
• Regulatory  RoHS compliant to support environmentally responsible manufacturing and procurement.

Typical Applications

• High-density I/O systems  Use the 920 I/O pins to implement multi-protocol bridging, parallel peripherals and complex interface routing on a single device.
• Signal processing and streaming  Large logic resources and on-chip RAM enable implementation of pipelined datapaths, buffering and real-time processing tasks.
• Industrial control equipment  Industrial temperature rating and robust packaging make it suitable for programmable control, motor drive logic and factory automation subsystems.
• Prototyping and custom logic  High logic element count supports hardware prototyping and development of application-specific accelerators and controllers.

Unique Advantages

• Highly integrated logic and memory: Combines 353,600 logic elements with approximately 23.1 Mbits of embedded RAM to reduce reliance on external components and simplify board design.
• Exceptional I/O scale: 920 I/O pins provide flexibility for high-channel-count interfaces and complex system interconnects.
• Industrial-ready operation: Specified for −40 °C to 100 °C operation, enabling reliable deployment in many industrial environments.
• Compact, manufacturable package: 1932-BBGA FCBGA surface-mount package supports dense PCB layouts and automated assembly processes.
• Low-voltage operation: Supply range of 870 mV to 930 mV allows integration with systems using tight core-voltage domains.
• RoHS compliant: Meets RoHS requirements for environmentally conscious product development and procurement.

Why Choose EP4SGX360NF45I3N?

The EP4SGX360NF45I3N positions itself as a high-capacity, industrial-grade FPGA for designs demanding extensive programmable logic, significant on-chip memory and substantial I/O. Its combination of 353,600 logic elements, approximately 23.1 Mbits of embedded RAM and 920 I/O pins supports consolidation of complex functions into a single device, helping reduce BOM complexity and board space.

Manufactured by Intel and supplied in a 1932-BBGA FCBGA surface-mount package, this device is well suited for engineers building industrial control, signal processing, high-density interface and prototyping solutions that require robust temperature operation and compact assembly.

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