EP4SGX360NF45C4

The EP4SGX360NF45C4 is an Intel Stratix IV GX Field Programmable Gate Array (FPGA) designed for high-density digital designs. It delivers 353,600 logic elements, approximately 23.1 Mbits of embedded memory, and 920 I/O pins in a high‑density FCBGA package.

This commercial‑grade, surface‑mount FPGA operates over a 0 °C to 85 °C range with a core supply window of 870 mV to 930 mV, and is RoHS compliant. Detailed electrical and switching characteristics are documented in the Stratix IV Device Handbook.

Key Features

• Core Logic — 353,600 logic elements for implementing large, complex digital functions and parallel processing pipelines.
• Embedded Memory — Approximately 23.1 Mbits of on‑chip RAM to support buffering, LUTRAM, and memory‑intensive datapaths without external RAM.
• I/O Density — 920 I/O pins to accommodate extensive external interfaces, peripherals, and board‑level connectivity.
• Package and Mounting — Available in a 1932‑BBGA FCBGA package (supplier package: 1932‑FBGA, FC, 45×45); surface‑mount construction supports compact, high‑density PCB layouts.
• Power — Core supply range of 870 mV to 930 mV to match system power architectures that target low‑voltage FPGA cores.
• Operating Grade — Commercial temperature rating from 0 °C to 85 °C for standard embedded and production environments.
• Regulatory — RoHS compliant for lead‑free and environmentally conscious designs.

Typical Applications

• High‑density digital systems — Implement complex logic, custom processors, or large state machines that require substantial on‑chip resources.
• High‑I/O interface hubs — Aggregate and route signals across many peripherals and interfaces thanks to the 920 available I/Os.
• Memory‑intensive functions — Use the embedded ~23.1 Mbits of RAM for buffering, packet staging, or intermediate storage without immediate external memory dependency.
• Prototyping and development platforms — Support advanced FPGA designs that need significant logic capacity and high connectivity in a single device.

Unique Advantages

• Highly integrated logic and memory: 353,600 logic elements combined with ~23.1 Mbits of embedded RAM reduce external component needs and simplify board design.
• Extensive I/O capability: 920 I/Os enable dense connectivity and flexible interfacing to sensors, processors, and peripherals.
• Compact, high‑density packaging: 1932‑BBGA FCBGA (1932‑FBGA, FC 45×45) supports space‑constrained PCBs while providing high pin counts.
• Low‑voltage core operation: 870–930 mV supply range aligns with modern low‑power system rails for efficient power integration.
• Commercial temperature rating and RoHS compliance: Suitable for standard embedded applications and environmentally compliant production builds.

Why Choose EP4SGX360NF45C4?

The EP4SGX360NF45C4 positions itself as a high‑capacity Stratix IV GX FPGA suitable for designs that demand a large amount of programmable logic, significant embedded memory, and extensive I/O. Its combination of 353,600 logic elements, approximately 23.1 Mbits of on‑chip RAM, and 920 I/Os in a compact FCBGA package addresses integration and space challenges on complex boards.

This device is ideal for engineering teams building advanced digital systems that prioritize on‑chip resources and I/O flexibility in a commercial temperature range. Detailed electrical, timing, and configuration information is provided in the Stratix IV Device Handbook to support design and validation activities.

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