EP4SGX360NF45I3
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 920 23105536 353600 1932-BBGA, FCBGA |
|---|---|
| Quantity | 539 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 920 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14144 | Number of Logic Elements/Cells | 353600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 23105536 |
Overview of EP4SGX360NF45I3 – Stratix IV GX FPGA IC — 920 I/Os, approximately 23.1 Mbits embedded memory, 353,600 logic elements
The EP4SGX360NF45I3 is a Stratix IV GX field-programmable gate array (FPGA) in a 1932-ball FCBGA package intended for high-density, system-level integration. Built on the Stratix IV device family architecture, it provides a large logic fabric, substantial on-chip RAM, and a high I/O count for complex digital designs.
This industrial-grade FPGA targets applications that require extensive logic capacity, significant embedded memory, and broad I/O connectivity while operating across a wide temperature range. Core benefits from the device data include high integration, scalability for large designs, and compatibility with surface-mount PCB assembly processes.
Key Features
- Core Architecture — Stratix IV GX Device family architecture optimized for high-performance FPGA implementations as documented in the Stratix IV device handbook.
- Large Logic Capacity 353,600 logic elements to implement complex custom logic, state machines, and system controllers.
- Significant Embedded Memory Approximately 23.1 Mbits of on-chip RAM for buffering, lookup tables, and local storage.
- High I/O Count 920 I/O pins to support dense external interfaces and multi-channel system integration.
- Power Core Voltage Core supply range specified at 870 mV to 930 mV to match system power design requirements.
- Industrial Temperature Rating Rated for operation from −40 °C to 100 °C to meet industrial environmental demands.
- Package and Mounting 1932-ball BGA (FCBGA, 45 × 45) surface-mount package for compact, high-density board designs.
- Standards and Compliance RoHS compliant to meet common environmental directive requirements.
- System-Level Features (from device handbook) Documented support in the Stratix IV family for high-speed transceiver features, external memory interfaces, DSP blocks, and advanced clock/PLL resources as part of the device architecture.
Typical Applications
- High-speed communication systems Use the device's large logic capacity and documented transceiver-related features to implement protocol processing and data-path logic.
- Memory interface and buffering Embedded memory (approximately 23.1 Mbits) supports on-chip buffering and local storage for external memory controllers and data staging.
- DSP and signal processing Stratix IV family DSP resources and large logic fabric support compute-intensive signal processing pipelines and custom accelerators.
- Complex system integration High I/O count (920 pins) enables aggregation of multiple interfaces, sensor arrays, or mezzanine-level connections on a single FPGA.
Unique Advantages
- High logic density: 353,600 logic elements enable large, integrated designs that reduce the need for multiple discrete FPGAs.
- Substantial on-chip RAM: Approximately 23.1 Mbits of embedded memory provides local buffering to simplify external memory bandwidth requirements.
- Extensive I/O availability: 920 I/Os allow flexible system partitioning and support for numerous parallel interfaces without external multiplexing.
- Industrial-temperature operation: −40 °C to 100 °C rating supports deployment in thermally demanding environments.
- Compact, high-density packaging: 1932-ball FCBGA (45 × 45) supports space-constrained PCB layouts while enabling surface-mount assembly.
- Power domain defined: Core voltage range 870–930 mV provides a clear target for power-supply design and thermal planning.
Why Choose EP4SGX360NF45I3?
The EP4SGX360NF45I3 positions itself as a high-capacity Stratix IV GX FPGA for designs that demand large logic resources, significant embedded memory, and many high-density I/Os in an industrial-temperature package. Its documented device-family features—including transceiver support, DSP blocks, and robust clock/PLL resources—make it suitable for system-level implementations where integration and scalability matter.
Choose this device when your project requires a scalable FPGA fabric with substantial on-chip RAM and I/O connectivity, packaged for compact board integration and specified for industrial operating conditions. The combination of these documented specifications supports long-term design stability and system consolidation.
Request a quote or submit an inquiry to obtain pricing and availability information for EP4SGX360NF45I3. Our team can provide lead‑time details and help evaluate the fit for your design requirements.

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