EP4SGX360NF45I3

IC FPGA 920 I/O 1932FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 920 23105536 353600 1932-BBGA, FCBGA

Quantity 539 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O920Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14144Number of Logic Elements/Cells353600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits23105536

Overview of EP4SGX360NF45I3 – Stratix IV GX FPGA IC — 920 I/Os, approximately 23.1 Mbits embedded memory, 353,600 logic elements

The EP4SGX360NF45I3 is a Stratix IV GX field-programmable gate array (FPGA) in a 1932-ball FCBGA package intended for high-density, system-level integration. Built on the Stratix IV device family architecture, it provides a large logic fabric, substantial on-chip RAM, and a high I/O count for complex digital designs.

This industrial-grade FPGA targets applications that require extensive logic capacity, significant embedded memory, and broad I/O connectivity while operating across a wide temperature range. Core benefits from the device data include high integration, scalability for large designs, and compatibility with surface-mount PCB assembly processes.

Key Features

  • Core Architecture — Stratix IV GX Device family architecture optimized for high-performance FPGA implementations as documented in the Stratix IV device handbook.
  • Large Logic Capacity 353,600 logic elements to implement complex custom logic, state machines, and system controllers.
  • Significant Embedded Memory Approximately 23.1 Mbits of on-chip RAM for buffering, lookup tables, and local storage.
  • High I/O Count 920 I/O pins to support dense external interfaces and multi-channel system integration.
  • Power Core Voltage Core supply range specified at 870 mV to 930 mV to match system power design requirements.
  • Industrial Temperature Rating Rated for operation from −40 °C to 100 °C to meet industrial environmental demands.
  • Package and Mounting 1932-ball BGA (FCBGA, 45 × 45) surface-mount package for compact, high-density board designs.
  • Standards and Compliance RoHS compliant to meet common environmental directive requirements.
  • System-Level Features (from device handbook) Documented support in the Stratix IV family for high-speed transceiver features, external memory interfaces, DSP blocks, and advanced clock/PLL resources as part of the device architecture.

Typical Applications

  • High-speed communication systems Use the device's large logic capacity and documented transceiver-related features to implement protocol processing and data-path logic.
  • Memory interface and buffering Embedded memory (approximately 23.1 Mbits) supports on-chip buffering and local storage for external memory controllers and data staging.
  • DSP and signal processing Stratix IV family DSP resources and large logic fabric support compute-intensive signal processing pipelines and custom accelerators.
  • Complex system integration High I/O count (920 pins) enables aggregation of multiple interfaces, sensor arrays, or mezzanine-level connections on a single FPGA.

Unique Advantages

  • High logic density: 353,600 logic elements enable large, integrated designs that reduce the need for multiple discrete FPGAs.
  • Substantial on-chip RAM: Approximately 23.1 Mbits of embedded memory provides local buffering to simplify external memory bandwidth requirements.
  • Extensive I/O availability: 920 I/Os allow flexible system partitioning and support for numerous parallel interfaces without external multiplexing.
  • Industrial-temperature operation: −40 °C to 100 °C rating supports deployment in thermally demanding environments.
  • Compact, high-density packaging: 1932-ball FCBGA (45 × 45) supports space-constrained PCB layouts while enabling surface-mount assembly.
  • Power domain defined: Core voltage range 870–930 mV provides a clear target for power-supply design and thermal planning.

Why Choose EP4SGX360NF45I3?

The EP4SGX360NF45I3 positions itself as a high-capacity Stratix IV GX FPGA for designs that demand large logic resources, significant embedded memory, and many high-density I/Os in an industrial-temperature package. Its documented device-family features—including transceiver support, DSP blocks, and robust clock/PLL resources—make it suitable for system-level implementations where integration and scalability matter.

Choose this device when your project requires a scalable FPGA fabric with substantial on-chip RAM and I/O connectivity, packaged for compact board integration and specified for industrial operating conditions. The combination of these documented specifications supports long-term design stability and system consolidation.

Request a quote or submit an inquiry to obtain pricing and availability information for EP4SGX360NF45I3. Our team can provide lead‑time details and help evaluate the fit for your design requirements.

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