EP4SGX360NF45C3N

The EP4SGX360NF45C3N is a Stratix® IV GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 1932‑BBGA (FCBGA) package. It provides high-density programmable logic, substantial on-chip memory, and an extensive I/O complement for demanding system designs.

Targeted at commercial applications that require large-scale integration, the device combines 353,600 logic elements, approximately 23.1 Mbits of embedded memory, and 920 I/O pins to enable complex signal processing, high‑bandwidth interfacing, and system consolidation. Operating on a core supply range of 0.870–0.930 V and rated for 0 °C to 85 °C, it supports surface-mount assembly in a 45 × 45 mm FBGA footprint.

Key Features

• High-density Core — 353,600 logic elements to implement large, complex designs and consolidate multiple functions into a single device.
• On-chip Memory — Approximately 23.1 Mbits of embedded RAM to support deep buffering, FIFOs, and memory‑intensive algorithms.
• Extensive I/O — 920 I/O pins provide broad external connectivity for parallel interfaces, high‑speed buses, and multi-port designs.
• Transceivers and DSP Resources — Series documentation includes transceiver and DSP block specifications, enabling high‑speed serial links and hardware-accelerated signal processing when utilized.
• Clocking and Configuration — Device handbook references PLLs, clock tree specifications, and configuration/JTAG support for robust timing and system bring-up.
• Power and Thermal — Core voltage supply 0.870–0.930 V and commercial operating temperature range of 0 °C to 85 °C for standard commercial deployments.
• Package and Mounting — 1932‑BBGA (supplier package: 1932‑FBGA, FC 45×45) in a surface‑mount format for compact board integration.
• Compliance — RoHS compliant and supplied as a commercial‑grade FPGA.

Typical Applications

• Network and Communications Equipment — Leverages the device’s extensive I/O and transceiver-capable architecture for high‑bandwidth interfaces and protocol processing.
• High‑Performance Signal Processing — Uses large logic capacity and embedded memory to implement DSP pipelines, filtering, and real‑time data manipulation.
• System Integration and Consolidation — Enables consolidation of multiple functions into a single FPGA to reduce board count and simplify system architectures.
• Custom Computing and Acceleration — Supports hardware acceleration for compute‑intensive tasks using the available logic resources and memory blocks.

Unique Advantages

• Large Programmable Fabric — 353,600 logic elements allow designers to implement complex, multi‑function systems on a single device, reducing BOM and board complexity.
• Significant Embedded Memory — Approximately 23.1 Mbits of on‑chip RAM supports deep buffering and memory‑centric algorithms without relying on external memory.
• High I/O Count — 920 I/O pins enable broad interfacing options for parallel data paths, multi‑lane interfaces, and flexible system connectivity.
• Expandable System Design — Documentation coverage for transceivers, PLLs, DSP blocks, and TriMatrix memory blocks gives designers the building blocks for scalable, high‑performance architectures.
• Package Density — 1932‑BBGA (45 × 45 mm) FCBGA package supports high pin count in a compact surface‑mount form factor for space-constrained boards.
• Commercial Availability and Compliance — Commercial grade and RoHS compliant for mainstream product lines and standard manufacturing flows.

Why Choose EP4SGX360NF45C3N?

The EP4SGX360NF45C3N positions itself as a high‑capacity Stratix® IV GX FPGA suited to complex commercial designs that demand large programmable logic resources, substantial embedded memory, and broad I/O. Its combination of 353,600 logic elements, roughly 23.1 Mbits of on‑chip RAM, and 920 I/O pins makes it appropriate for system-level integration where consolidation and performance are priorities.

Engineers targeting high‑bandwidth interfaces, signal processing acceleration, and consolidated system architectures will find the documented transceiver, DSP, clocking, and memory resources useful for designing scalable solutions. The device’s surface‑mount 1932‑BBGA package and standard commercial temperature rating support conventional production and deployment environments.

Request a quote or submit a purchasing inquiry to get pricing, lead‑time information, and availability for the EP4SGX360NF45C3N. Our team can provide the technical and procurement details needed to move your design forward.