EP4SGX530HH35C2ES
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 28033024 531200 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,109 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-HBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530HH35C2ES – Stratix IV GX FPGA, 531,200 Logic Elements, 1152-BBGA
The EP4SGX530HH35C2ES is a Stratix® IV GX field-programmable gate array (FPGA) offering a high-density logic fabric and a broad set of system-level features suited for bandwidth- and compute-intensive designs. Built around the Stratix IV architecture, the device targets networking, communications, digital signal processing and other applications that require significant on-chip logic, memory and I/O integration.
With 531,200 logic elements, approximately 28 Mbits of embedded memory, and 564 I/O pins in a 1152-BBGA (FCBGA) package, this commercial‑grade device delivers the integration and connectivity needed to consolidate complex system functions while meeting standard commercial operating conditions.
Key Features
- Core logic density — 531,200 logic elements to implement large-scale digital designs and complex control logic.
- Embedded memory — Approximately 28 Mbits of on-chip RAM to support buffering, on-chip data storage and local memory structures.
- I/O and connectivity — 564 user I/O pins to support wide external interfacing across multiple buses and peripherals.
- Stratix IV GX family features — Series-level capabilities include high-speed transceivers, wide protocol support, signal integrity measures and diagnostic features as described in the Stratix IV device handbook.
- Clocking and DSP support — Family documentation specifies comprehensive clock networks, PLLs and DSP block support for timing, synchronization and signal processing tasks.
- Power supply — Core supply requirement specified from 870 mV to 930 mV for integration into regulated power systems.
- Package & mounting — 1152-BBGA (supplier package listed as 1152-HBGA, 42.5 × 42.5 mm) for surface-mount assembly in compact board layouts.
- Operating range & compliance — Commercial grade with an operating temperature range of 0°C to 85°C and RoHS compliance for environmental requirements.
Typical Applications
- Networking & communications equipment — Implement high-aggregate-bandwidth interfaces, protocol processing and packet handling using the device’s logic density and family-level transceiver features.
- Digital signal processing — Use embedded memory and DSP-capable fabric for filtering, transforms and real-time signal processing tasks.
- High-performance control and compute modules — Consolidate complex control functions and custom accelerators that benefit from abundant logic and on-chip RAM.
- Video and imaging systems — Leverage large logic resources and on-chip memory to handle frame buffering, preprocessing and custom video pipelines.
Unique Advantages
- High logic capacity: 531,200 logic elements enable implementation of large, integrated systems on a single device, reducing board-level complexity.
- Substantial embedded memory: Approximately 28 Mbits of on-chip RAM lowers external memory dependence and simplifies memory subsystem design.
- Extensive I/O count: 564 I/O pins provide flexible connectivity to peripherals, memory interfaces and I/O-rich daughter cards.
- Compact, assembly-friendly package: 1152-BBGA / 1152-HBGA (42.5 × 42.5 mm) allows high-density PCB designs and surface-mount manufacturing.
- Designed for high-bandwidth designs: Stratix IV GX family features (high-speed transceivers, protocol support, signal integrity tools) support demanding data-path and interface requirements.
- Regulatory and environmental fit: RoHS compliance supports regulatory requirements for many commercial products and regions.
Why Choose EP4SGX530HH35C2ES?
The EP4SGX530HH35C2ES positions itself as a high-density, feature-rich Stratix IV GX FPGA suitable for developers who need significant on-chip logic, memory and I/O in a single commercial-grade device. Its combination of 531,200 logic elements, roughly 28 Mbits of embedded RAM and 564 I/O pins enables consolidation of complex functions and high-throughput interfaces while adhering to standard commercial operating temperatures and RoHS requirements.
This device is aimed at design teams building networking, signal-processing and compute-accelerated applications that benefit from the Stratix IV family’s transceiver and fabric capabilities, compact FCBGA packaging and clearly specified power and thermal operating ranges.
Request a quote or contact sales to discuss availability, lead times and pricing for the EP4SGX530HH35C2ES.

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