EP4SGX530HH35I4N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 28033024 531200 1152-BBGA, FCBGA |
|---|---|
| Quantity | 415 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-HBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530HH35I4N – Stratix® IV GX FPGA, 531,200 logic elements, 564 I/O
The EP4SGX530HH35I4N is an Intel Stratix IV GX field-programmable gate array optimized for high-density, I/O-rich designs. As a Stratix IV GX device, the part delivers a large programmable fabric with integrated memory resources and series-documented features such as high-performance transceiver, DSP and clocking capabilities.
Targeted at industrial applications, this surface-mount FCBGA package provides extensive logic resources, approximately 28 Mbits of embedded memory, and 564 user I/Os to support complex signal processing, protocol bridging and system integration tasks while operating across a wide industrial temperature range.
Key Features
- High-density programmable fabric — 531,200 logic elements provide substantial capacity for large-scale logic, control and datapath implementations.
- Embedded memory — approximately 28 Mbits of on-chip RAM for buffering, packet storage and memory-intensive algorithms.
- I/O and package — 564 user I/Os in a 1152-BBGA / 1152-HBGA FCBGA surface-mount package (42.5 × 42.5 mm) for high-pin-count integration and compact board-level designs.
- Power and core supply — core supply range specified from 870 mV to 930 mV to match system power delivery and sequencing requirements.
- Industrial temperature grade — qualified to operate from −40 °C to 100 °C for reliable performance in demanding environments.
- Series-level system building blocks — Stratix IV device handbook documents core performance elements including transceiver performance, PLL and clock-tree specifications, DSP block and TriMatrix memory block specifications to support high-speed serial links and DSP-oriented designs.
- Manufacturing and compliance — surface-mount FCBGA package and RoHS-compliant status to meet modern assembly and environmental standards.
Typical Applications
- High-speed communications — suitable for designs requiring large logic capacity and series-documented transceiver performance for protocol bridging and packet processing.
- Signal processing and DSP — the device’s large logic fabric and documented DSP block specifications support computationally intensive algorithms and real-time data paths.
- Network and infrastructure equipment — abundant I/O and on-chip memory allow for switching, buffering and protocol handling in networking and data center infrastructure.
- Industrial control and instrumentation — industrial temperature rating and high I/O count enable robust control, monitoring and sensor-interfacing systems.
Unique Advantages
- Extensive logic capacity: 531,200 logic elements let you implement large, integrated designs without partitioning across multiple devices.
- Substantial embedded memory: Approximately 28 Mbits of on-chip RAM reduces external memory dependencies and lowers BOM complexity.
- High I/O count in compact package: 564 I/Os in a 1152-BBGA/FCBGA (42.5 × 42.5 mm) footprint balances board-level density with signal routing flexibility.
- Designed for industrial environments: −40 °C to 100 °C operating range provides headroom for deployment in thermally challenging applications.
- Series-proven system features: documented transceiver, PLL, clock-tree and DSP block specifications in the Stratix IV device handbook help shorten design validation and integration effort.
- RoHS compliant and surface-mount ready: eases compliance and assembly for modern manufacturing flows.
Why Choose EP4SGX530HH35I4N?
The EP4SGX530HH35I4N positions itself as a high-capacity, industrial-grade Stratix IV GX FPGA for systems that demand large programmable logic, generous embedded memory and a high I/O complement in a single-package solution. Its documented series-level capabilities for transceivers, DSP and clocking make it suitable for developers addressing high-speed communications, signal processing, and complex system integration.
For engineering teams and procurement focused on long-lived, scalable platforms, this device offers a combination of integration, thermal robustness and package-level I/O density to streamline board design and reduce external component count while leveraging the Stratix IV device documentation during development.
Request a quote or submit a product inquiry to check availability, pricing and lead times for EP4SGX530HH35I4N.

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