EP4SGX530HH35I4N

IC FPGA 564 I/O 1152HBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 28033024 531200 1152-BBGA, FCBGA

Quantity 415 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-HBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SGX530HH35I4N – Stratix® IV GX FPGA, 531,200 logic elements, 564 I/O

The EP4SGX530HH35I4N is an Intel Stratix IV GX field-programmable gate array optimized for high-density, I/O-rich designs. As a Stratix IV GX device, the part delivers a large programmable fabric with integrated memory resources and series-documented features such as high-performance transceiver, DSP and clocking capabilities.

Targeted at industrial applications, this surface-mount FCBGA package provides extensive logic resources, approximately 28 Mbits of embedded memory, and 564 user I/Os to support complex signal processing, protocol bridging and system integration tasks while operating across a wide industrial temperature range.

Key Features

  • High-density programmable fabric — 531,200 logic elements provide substantial capacity for large-scale logic, control and datapath implementations.
  • Embedded memory — approximately 28 Mbits of on-chip RAM for buffering, packet storage and memory-intensive algorithms.
  • I/O and package — 564 user I/Os in a 1152-BBGA / 1152-HBGA FCBGA surface-mount package (42.5 × 42.5 mm) for high-pin-count integration and compact board-level designs.
  • Power and core supply — core supply range specified from 870 mV to 930 mV to match system power delivery and sequencing requirements.
  • Industrial temperature grade — qualified to operate from −40 °C to 100 °C for reliable performance in demanding environments.
  • Series-level system building blocks — Stratix IV device handbook documents core performance elements including transceiver performance, PLL and clock-tree specifications, DSP block and TriMatrix memory block specifications to support high-speed serial links and DSP-oriented designs.
  • Manufacturing and compliance — surface-mount FCBGA package and RoHS-compliant status to meet modern assembly and environmental standards.

Typical Applications

  • High-speed communications — suitable for designs requiring large logic capacity and series-documented transceiver performance for protocol bridging and packet processing.
  • Signal processing and DSP — the device’s large logic fabric and documented DSP block specifications support computationally intensive algorithms and real-time data paths.
  • Network and infrastructure equipment — abundant I/O and on-chip memory allow for switching, buffering and protocol handling in networking and data center infrastructure.
  • Industrial control and instrumentation — industrial temperature rating and high I/O count enable robust control, monitoring and sensor-interfacing systems.

Unique Advantages

  • Extensive logic capacity: 531,200 logic elements let you implement large, integrated designs without partitioning across multiple devices.
  • Substantial embedded memory: Approximately 28 Mbits of on-chip RAM reduces external memory dependencies and lowers BOM complexity.
  • High I/O count in compact package: 564 I/Os in a 1152-BBGA/FCBGA (42.5 × 42.5 mm) footprint balances board-level density with signal routing flexibility.
  • Designed for industrial environments: −40 °C to 100 °C operating range provides headroom for deployment in thermally challenging applications.
  • Series-proven system features: documented transceiver, PLL, clock-tree and DSP block specifications in the Stratix IV device handbook help shorten design validation and integration effort.
  • RoHS compliant and surface-mount ready: eases compliance and assembly for modern manufacturing flows.

Why Choose EP4SGX530HH35I4N?

The EP4SGX530HH35I4N positions itself as a high-capacity, industrial-grade Stratix IV GX FPGA for systems that demand large programmable logic, generous embedded memory and a high I/O complement in a single-package solution. Its documented series-level capabilities for transceivers, DSP and clocking make it suitable for developers addressing high-speed communications, signal processing, and complex system integration.

For engineering teams and procurement focused on long-lived, scalable platforms, this device offers a combination of integration, thermal robustness and package-level I/O density to streamline board design and reduce external component count while leveraging the Stratix IV device documentation during development.

Request a quote or submit a product inquiry to check availability, pricing and lead times for EP4SGX530HH35I4N.

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