EP4SGX530KF43C2

The EP4SGX530KF43C2 is a Stratix® IV GX Field Programmable Gate Array (FPGA) from Intel, packaged in a 1760-ball FCBGA (42.5×42.5 mm). It delivers high logic density, abundant embedded memory, and a large I/O count for designs that require extensive on-chip resources and connectivity.

Designed for commercial-temperature applications, this device targets complex digital signal processing, high-density logic integration and I/O-intensive systems where a combination of performance, on-chip memory and flexible I/O is required.

Key Features

• Core Logic  Provides 531,200 logic elements for implementing large-scale, custom digital designs and complex state machines.
• Embedded Memory  Includes approximately 28 Mbits of on-chip RAM suitable for buffering, LUTs and implementation of memory-intensive algorithms.
• I/O and Connectivity  Offers 880 user I/Os to support extensive peripheral, bus and front-end interfaces; device documentation includes transceiver performance specifications for serial connectivity.
• Transceiver, DSP and Memory Blocks (series-level)  Device handbook sections cover transceiver performance, DSP block specifications and TriMatrix memory block specifications for the Stratix IV family.
• Package and Mounting  1760-FCBGA (42.5×42.5 mm) package, surface-mount mounting type for standard PCB assembly processes.
• Power  Core supply operating range specified at 0.870 V to 0.930 V.
• Temperature and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-speed communications  Leverages the Stratix IV GX series transceiver specifications and high I/O count to implement serial links and connectivity fabrics.
• Signal processing and DSP acceleration  Large logic capacity and dedicated DSP block specifications in the device handbook make this device suitable for compute-intensive signal-processing pipelines.
• Memory-intensive algorithms  Approximately 28 Mbits of embedded memory supports buffering, packet processing and on-chip data storage for real-time processing.
• I/O-rich control and aggregation  With 880 I/Os, the device can consolidate multiple interfaces and handle complex data routing in communication and instrumentation applications.

Unique Advantages

• High logic density: 531,200 logic elements enable integration of large FPGA designs that would otherwise require multiple devices.
• Substantial on-chip memory: Approximately 28 Mbits of embedded RAM reduce external memory needs and simplify board-level design.
• Extensive connectivity: 880 I/Os provide flexibility for multi-interface systems and complex front-end configurations.
• Compact, manufacturable package: 1760-FCBGA (42.5×42.5 mm) surface-mount package supports standard PCB assembly workflows while delivering high pin density.
• Low-voltage core operation: Core supply range of 0.870–0.930 V supports optimized power delivery planning for system designs.
• Documented system-level features: The device handbook includes detailed sections on DC/switching characteristics, PLLs, clock-tree behavior, transceivers, DSP blocks and TriMatrix memory blocks to support design validation and performance tuning.

Why Choose EP4SGX530KF43C2?

The EP4SGX530KF43C2 combines a high count of logic elements, significant embedded memory and a large number of I/Os in a single 1760-FCBGA package, making it well suited to demanding commercial designs that require integration of complex logic, signal processing and extensive connectivity. Its documented series-level specifications for transceivers, DSP and memory blocks provide a technical foundation for system architects and hardware engineers to evaluate performance and integration trade-offs.

This device is appropriate for teams seeking a scalable FPGA platform with substantial on-chip resources, clear operating-voltage and temperature specifications, and RoHS compliance for standard commercial deployments.

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