EP4SGX530KF43C2G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 660 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 880 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530KF43C2G – Field Programmable Gate Array (FPGA) IC
The EP4SGX530KF43C2G is a high-density Field Programmable Gate Array (FPGA) from Intel, based on the Stratix IV device family. It delivers a programmable fabric and system-level features targeted at designs that require large logic capacity, extensive on-chip memory and advanced I/O capability.
Key characteristics include approximately 531,200 logic elements, roughly 28 Mbits of embedded memory, 880 I/O pins, and architecture-level features such as high-speed transceiver support, DSP blocks, PLLs and external memory interfaces. The device ships in a 1760-FCBGA surface-mount package and is specified for commercial operation (0 °C to 85 °C).
Key Features
- Core density Approximately 531,200 logic elements to implement large-scale, complex logic and control functions.
- Configurable logic blocks 21,248 CLBs for structured logic partitioning and implementation.
- Embedded memory Approximately 28 Mbits of on-chip RAM (28,033,024 total RAM bits) to support buffers, FIFOs and local data storage.
- I/O availability 880 I/O pins to support broad device interfacing and multi-channel connectivity.
- Package and mounting 1760-FCBGA supplier device package (42.5×42.5) in a surface-mount form factor; package case listed as 1760-BBGA, FCBGA.
- Power Core voltage supply specified 870 mV to 930 mV to match platform power-rail requirements.
- Commercial temperature grade Specified for operation from 0 °C to 85 °C.
- Stratix IV architecture features Device family documentation highlights high-speed transceiver features, DSP blocks, PLLs, clock networks and external memory interface support for system-level integration.
- Environmental compliance RoHS compliant.
Typical Applications
- High-bandwidth communications Use in networking and telecom equipment where large logic capacity and high I/O count enable protocol processing and packet handling.
- Digital signal processing Suitable for implementations that leverage on-chip DSP blocks and embedded memory for real-time signal and video processing pipelines.
- Memory interface controllers Deploy as a bridge or controller in systems requiring external memory interfaces supported by the Stratix IV architecture.
- System integration and prototyping Provides the resources needed for complex system integration tasks and advanced prototyping of high-density designs.
Unique Advantages
- High logic capacity: Approximately 531,200 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
- Significant on-chip memory: Nearly 28 Mbits of embedded RAM lowers dependence on external memory for buffering and local data storage.
- Extensive I/O: 880 I/O pins provide flexible connectivity for multi-channel interfaces and broad peripheral support.
- System-level feature set: Architecture-level support for high-speed transceivers, DSP blocks, PLLs and external memory interfaces simplifies implementation of bandwidth-intensive designs.
- Commercial readiness: Specified 0 °C to 85 °C operating range and RoHS compliance make the device suitable for production commercial applications.
Why Choose EP4SGX530KF43C2G?
The EP4SGX530KF43C2G combines large logic density, substantial embedded memory and a broad I/O complement within a 1760-FCBGA surface-mount package, offering an integrated platform for high-performance commercial designs. Its alignment with the Stratix IV device family provides a documented architecture that includes transceivers, DSP resources and clocking options to address bandwidth- and compute-intensive applications.
This device is well suited for engineers and teams implementing advanced communication, signal processing or system-integration projects that require scalability, on-chip memory resources and a high I/O count. The commercial-grade specification and RoHS compliance support deployment in production commercial systems.
Request a quote or submit an inquiry to obtain pricing and availability for the EP4SGX530KF43C2G. Technical and purchasing teams can use the device specifications to evaluate fit for your design requirements.

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