EP4SGX530KF43C3N

The EP4SGX530KF43C3N is a Stratix® IV GX Field Programmable Gate Array (FPGA) offered in a 1760‑ball FCBGA package. It provides a high on‑chip logic capacity and extensive I/O for complex digital designs that require dense programmable logic and substantial embedded memory.

With 531,200 logic elements, approximately 28 Mbits of embedded RAM and 880 I/O pins, this commercial‑grade FPGA targets applications where large logic density, abundant I/O connectivity, and FCBGA packaging are primary considerations. The device operates from a 0.87 V to 0.93 V core supply and across a 0 °C to 85 °C commercial temperature range, and is RoHS compliant.

Key Features

• Logic Capacity — 531,200 logic elements to implement large, complex digital functions and parallel processing architectures.
• Embedded Memory — Approximately 28 Mbits of on‑chip RAM for buffering, lookup tables, and on‑chip data storage.
• I/O Density — 880 I/O pins to support wide bus interfaces, multiple peripherals, and high‑pin count system integration.
• Power Supply — Core voltage range of 870 mV to 930 mV to match system power-rail requirements for this device family.
• Package and Mounting — 1760‑FCBGA (42.5 × 42.5 mm) ball grid array in a surface‑mount format for compact board layouts and high‑density interconnects.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial environments.
• Environmental Compliance — RoHS compliant to support restricted‑substance requirements.

Typical Applications

• Complex digital systems — Dense logic capacity and embedded RAM enable implementation of large state machines, protocol processing, and multi‑lane data paths.
• High‑I/O interface controllers — 880 I/O pins accommodate broad parallel interfaces, multi‑protocol bridging, and extensive peripheral connectivity.
• On‑chip buffering and data staging — Approximately 28 Mbits of embedded memory supports packet buffering, FIFOs, and scratchpad storage for streaming data workflows.

Unique Advantages

• High logic density: 531,200 logic elements let designers map large combinational and sequential logic without external CPLDs or discrete logic.
• Substantial embedded memory: Approximately 28 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and temporary storage needs.
• Extensive I/O count: 880 I/Os simplify board design by providing direct connectivity to multiple buses and peripherals.
• Compact FCBGA package: 1760‑FCBGA (42.5 × 42.5 mm) offers a high‑pin‑count footprint suitable for space‑constrained, high‑performance PCBs.
• Commercial temperature and RoHS compliance: Clear environmental and operating limits support standard commercial deployments and regulatory requirements.

Why Choose EP4SGX530KF43C3N?

The EP4SGX530KF43C3N positions itself for designs that demand very large programmable logic capacity combined with significant on‑chip RAM and a high number of I/O. Its 1760‑ball FCBGA package and surface‑mount mounting make it suitable for compact, high‑density boards where pin count and memory reduce system complexity and external components.

This commercial‑grade FPGA is appropriate for teams building complex digital subsystems that benefit from integrated memory, abundant I/O, and a well‑defined supply and temperature range. Its specifications support scalability within projects that require a large programmable fabric and on‑chip resources to simplify BOM and integration.

Request a quote or submit an inquiry to receive pricing, availability, and support for integrating the EP4SGX530KF43C3N into your next design.