EP4SGX530KF43C4
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 880 28033024 531200 1760-BBGA, FCBGA |
|---|---|
| Quantity | 930 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 880 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530KF43C4 – Stratix® IV GX Field Programmable Gate Array (FPGA)
The EP4SGX530KF43C4 is an Intel Stratix IV GX FPGA supplied in a 1760-FCBGA package. It provides a high-capacity programmable fabric with a large logic element count, substantial on-chip memory, and a dense I/O complement for demanding digital designs.
Targeted at high-bandwidth data processing and complex system integration, this commercial-grade device delivers a combination of logic density, embedded memory, and I/O resources while operating over a core voltage range of 870 mV to 930 mV and a commercial temperature range of 0 °C to 85 °C.
Key Features
- Core Logic 531,200 logic elements provide a large programmable fabric suitable for complex digital functions and system-level integration.
- Logic Array Blocks (LABs) 21,248 LABs (as specified) to structure and organize logic for scalable design implementations.
- Embedded Memory Approximately 28 Mbits of embedded memory for on-chip buffering, FIFOs, and intermediate data storage.
- I/O Capacity 880 I/Os enable dense external connectivity for parallel interfaces, memory buses, and multi‑lane systems.
- Power and Voltage Core supply voltage range of 870 mV to 930 mV for the FPGA fabric.
- Package and Mounting 1760‑FBG A FCBGA package (42.5 × 42.5 mm) designed for surface-mount assembly to support high pin-count board designs.
- Operating Range and Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- RoHS Compliance RoHS‑compliant device to meet common environmental and regulatory requirements.
Typical Applications
- High‑bandwidth data processing Large logic capacity and significant embedded memory make the device suitable for packet processing, signal aggregation, and streaming data operations.
- Network and communications equipment Dense I/O count supports multi‑lane interfaces and complex board-level interconnects common in switches, routers, and aggregation platforms.
- Accelerators and compute modules High logic density and on-chip RAM support implementation of custom accelerators and coprocessors.
Unique Advantages
- High logic capacity: 531,200 logic elements enable implementation of large, integrated digital systems without immediate partitioning across multiple devices.
- Substantial embedded memory: Approximately 28 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state‑storage needs.
- Dense external connectivity: 880 I/Os accommodate broad peripheral sets, parallel buses, and multi‑channel interfaces from a single package.
- Compact high‑pin package: 1760‑FCBGA (42.5 × 42.5 mm) offers a high pin‑count solution in a single, surface‑mount form factor to simplify board integration.
- Commercial operating range: 0 °C to 85 °C rating aligns with a wide range of standard embedded and communications applications.
- Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and regulatory alignment.
Why Choose EP4SGX530KF43C4?
The EP4SGX530KF43C4 positions itself as a high‑capacity Stratix IV GX FPGA option for designs that require substantial programmable logic, significant embedded memory, and a large number of I/Os in a single device. Its FCBGA packaging and surface‑mount form factor simplify board-level implementation for complex systems.
This device is well suited for engineering teams building high‑bandwidth processing, communications, and compute-acceleration solutions that need scalable logic resources, on-chip RAM for buffering, and dense external connectivity while operating within commercial temperature and voltage ranges.
Request a quote or submit an inquiry to obtain pricing, availability, and additional ordering information for the EP4SGX530KF43C4.

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