EP4SGX530KF43C4

IC FPGA 880 I/O 1760FCBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 880 28033024 531200 1760-BBGA, FCBGA

Quantity 930 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O880Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SGX530KF43C4 – Stratix® IV GX Field Programmable Gate Array (FPGA)

The EP4SGX530KF43C4 is an Intel Stratix IV GX FPGA supplied in a 1760-FCBGA package. It provides a high-capacity programmable fabric with a large logic element count, substantial on-chip memory, and a dense I/O complement for demanding digital designs.

Targeted at high-bandwidth data processing and complex system integration, this commercial-grade device delivers a combination of logic density, embedded memory, and I/O resources while operating over a core voltage range of 870 mV to 930 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Core Logic  531,200 logic elements provide a large programmable fabric suitable for complex digital functions and system-level integration.
  • Logic Array Blocks (LABs)  21,248 LABs (as specified) to structure and organize logic for scalable design implementations.
  • Embedded Memory  Approximately 28 Mbits of embedded memory for on-chip buffering, FIFOs, and intermediate data storage.
  • I/O Capacity  880 I/Os enable dense external connectivity for parallel interfaces, memory buses, and multi‑lane systems.
  • Power and Voltage  Core supply voltage range of 870 mV to 930 mV for the FPGA fabric.
  • Package and Mounting  1760‑FBG A FCBGA package (42.5 × 42.5 mm) designed for surface-mount assembly to support high pin-count board designs.
  • Operating Range and Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • RoHS Compliance  RoHS‑compliant device to meet common environmental and regulatory requirements.

Typical Applications

  • High‑bandwidth data processing  Large logic capacity and significant embedded memory make the device suitable for packet processing, signal aggregation, and streaming data operations.
  • Network and communications equipment  Dense I/O count supports multi‑lane interfaces and complex board-level interconnects common in switches, routers, and aggregation platforms.
  • Accelerators and compute modules  High logic density and on-chip RAM support implementation of custom accelerators and coprocessors.

Unique Advantages

  • High logic capacity: 531,200 logic elements enable implementation of large, integrated digital systems without immediate partitioning across multiple devices.
  • Substantial embedded memory: Approximately 28 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state‑storage needs.
  • Dense external connectivity: 880 I/Os accommodate broad peripheral sets, parallel buses, and multi‑channel interfaces from a single package.
  • Compact high‑pin package: 1760‑FCBGA (42.5 × 42.5 mm) offers a high pin‑count solution in a single, surface‑mount form factor to simplify board integration.
  • Commercial operating range: 0 °C to 85 °C rating aligns with a wide range of standard embedded and communications applications.
  • Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and regulatory alignment.

Why Choose EP4SGX530KF43C4?

The EP4SGX530KF43C4 positions itself as a high‑capacity Stratix IV GX FPGA option for designs that require substantial programmable logic, significant embedded memory, and a large number of I/Os in a single device. Its FCBGA packaging and surface‑mount form factor simplify board-level implementation for complex systems.

This device is well suited for engineering teams building high‑bandwidth processing, communications, and compute-acceleration solutions that need scalable logic resources, on-chip RAM for buffering, and dense external connectivity while operating within commercial temperature and voltage ranges.

Request a quote or submit an inquiry to obtain pricing, availability, and additional ordering information for the EP4SGX530KF43C4.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up