EP4SGX530KF43I3

The EP4SGX530KF43I3 is a Stratix® IV GX field programmable gate array (FPGA) in a 1760-FCBGA package from Intel. It combines a very large logic capacity with substantial on-chip memory and a high I/O count, packaged for surface-mount assembly.

With industrial-grade temperature range and a low-voltage core supply window, this device is intended for designs that require high logic density, significant embedded memory, and large I/O integration in industrial environments.

Key Features

• Core Logic  531,200 logic elements provide extensive programmable logic resources for complex digital designs.
• Logic Blocks  Approximately 21,248 logic blocks to structure and partition large designs efficiently.
• Embedded Memory  Approximately 28 Mbits of embedded memory to support on-chip buffering, state storage, and local data processing.
• I/O Capacity  880 I/O pins to interface with large arrays of peripherals, memory devices, and system interconnects.
• Power and Supply  Core voltage supply range from 870 mV to 930 mV for the device core.
• Package and Mounting  1760-FCBGA package (42.5 mm × 42.5 mm), surface-mountable, providing a high-density footprint for board-level integration.
• Temperature and Grade  Industrial grade with operating temperature from −40 °C to 100 °C for deployment in demanding environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial control systems  Large logic capacity and industrial temperature range support complex control, monitoring, and automation functions.
• Communications and networking  High I/O count and substantial on-chip memory enable protocol processing, data buffering, and interface bridging.
• High-density digital processing  Massive logic resources and embedded RAM allow implementation of custom processing pipelines and datapath-heavy designs.

Unique Advantages

• Extensive logic resources: 531,200 logic elements reduce the need to partition designs across multiple devices.
• Large on-chip memory: Approximately 28 Mbits of embedded RAM supports local buffering and state retention without external memory dependence.
• High I/O integration: 880 I/Os enable direct connection to a wide range of peripherals and external devices, simplifying board-level routing.
• Industrial robustness: Rated for −40 °C to 100 °C operation to meet environmental demands of industrial deployments.
• Compact, high-density package: 1760-FCBGA (42.5 × 42.5 mm) balances integration density with routability for advanced PCB designs.
• Low-voltage core operation: Narrow core supply range (870 mV–930 mV) supports predictable power budgeting and design planning.

Why Choose EP4SGX530KF43I3?

The EP4SGX530KF43I3 positions itself as a high-capacity, industrial-grade FPGA option for applications that demand large programmable logic, significant embedded memory, and a high number of I/Os. Its combination of logic elements, on-chip RAM, and robust operating temperature range makes it suitable for complex, rugged designs where integration density and reliability are priorities.

This device is well suited for engineering teams building scalable digital systems, communications interfaces, and industrial automation solutions that require long-term platform stability and the ability to consolidate functionality into a single, high-density FPGA package.

Request a quote or submit your project requirements to receive pricing and availability for the EP4SGX530KF43I3. Our team can provide the information you need to move your design forward.