EP4SGX530KF43I4

IC FPGA 880 I/O 1760FCBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 880 28033024 531200 1760-BBGA, FCBGA

Quantity 1,568 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O880Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SGX530KF43I4 – Stratix® IV GX Field Programmable Gate Array (FPGA), 1760-FCBGA

The EP4SGX530KF43I4 is an Intel Stratix IV GX family FPGA in a 1760-FCBGA package, offering high logic capacity, extensive I/O and on‑chip memory for complex digital designs. It is supplied in an industrial-grade package and is designed for applications that require large programmable logic resources combined with high-speed I/O and embedded memory.

Device documentation for the Stratix IV family describes high-speed transceiver support, flexible I/O and a wide range of architecture features; this part implements those family capabilities with 531,200 logic elements, approximately 28 Mbits of embedded memory and up to 880 I/O pins.

Key Features

  • Logic Capacity — 531,200 logic elements (cells) to implement large, complex digital designs and custom processing pipelines.
  • Embedded Memory — Approximately 28 Mbits of on‑chip RAM, suitable for buffering, caches and memory‑intensive logic functions.
  • I/O Resources — Up to 880 I/O pins to support broad external interfacing and parallel connectivity requirements.
  • High‑Speed Transceiver and Protocol Support — Stratix IV GX family documentation highlights high‑speed transceiver features and broad protocol support for high‑bandwidth serial interfaces.
  • Power and Core Voltage — Core voltage supply specified from 870 mV to 930 mV for the FPGA core.
  • Package and Mounting — 1760‑FCBGA (42.5 × 42.5 mm) package, surface‑mount mounting type, suitable for compact system designs.
  • Industrial Temperature Rating — Operating temperature range from −40 °C to 100 °C for industrial applications.
  • Standards and Compliance — RoHS compliant material status.

Typical Applications

  • High‑speed serial communications — Use the family’s high‑speed transceiver features and protocol flexibility to implement serial links and protocol bridging.
  • Data buffering and packet processing — Large embedded memory and high logic density support packet buffering, flow control and custom packet handling functions.
  • Complex digital signal processing — The Stratix IV architecture includes DSP resources suitable for implementing signal processing pipelines when combined with the device’s logic and memory.

Unique Advantages

  • Substantial logic density: 531,200 logic elements provide the headroom for large finite state machines, datapaths and custom accelerators.
  • Significant on‑chip memory: Approximately 28 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching needs.
  • Extensive I/O connectivity: 880 I/Os enable complex system interfacing without immediate expansion hardware.
  • Industrial operating range: −40 °C to 100 °C supports deployments in industrial environments.
  • Compact FCBGA packaging: The 1760‑FCBGA (42.5 × 42.5 mm) package balances density and board‑level integration for space‑constrained systems.
  • Documented family features: Backed by Stratix IV device handbook documentation covering architecture, transceivers, clock networks and system integration.

Why Choose EP4SGX530KF43I4?

The EP4SGX530KF43I4 positions itself for designs that need a combination of high logic density, substantial on‑chip memory and broad I/O capability within an industrial temperature envelope. It aligns with applications requiring high aggregate data bandwidth and flexible protocol support as described in the Stratix IV GX device family documentation.

For engineering teams building complex FPGA‑based systems, this device offers scalability across logic, memory and I/O while remaining compliant with RoHS requirements and packaged for surface‑mount assembly in a 1760‑FCBGA footprint.

Request a quote or submit a product inquiry today to receive pricing and availability information for EP4SGX530KF43I4.

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