EP4SGX530KF43I4N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 880 28033024 531200 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,047 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 880 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530KF43I4N – Stratix® IV GX FPGA, 531,200 Logic Elements, 1760‑FCBGA
The EP4SGX530KF43I4N is a Stratix® IV GX field‑programmable gate array (FPGA) in a 1760‑FCBGA surface‑mount package. It provides a large programmable fabric with 531,200 logic elements and high I/O density to address demanding digital design tasks.
Designed for industrial applications, the device combines substantial embedded memory (approximately 28 Mbits), a high I/O count (880 I/Os), and architecture features described for the Stratix IV family such as high‑speed transceiver support, DSP blocks and flexible clocking to support networking, communications, and high‑performance signal processing designs.
Key Features
- Large programmable fabric — 531,200 logic elements for complex digital designs and high gate‑count implementations.
- Embedded memory — approximately 28 Mbits of on‑chip RAM to support buffering, FIFOs, and memory‑intensive algorithms.
- High I/O density — 880 I/O pins to interface with multiple peripherals and high‑bandwidth external devices.
- Stratix IV GX family features — includes architectural elements noted in the Stratix IV device handbook such as DSP blocks, PLLs and clock networks, and high‑speed transceiver capability for protocol support and data throughput.
- Package and mounting — 1760‑FCBGA (42.5 × 42.5 mm) surface‑mount package for high‑density board integration.
- Power and operating range — core supply specified from 870 mV to 930 mV and industrial grade operation from −40 °C to 100 °C.
- System integration and diagnostics — device family documentation highlights features for signal integrity and diagnostic support to aid system development and validation.
- RoHS compliant — meets environmental restrictions for lead‑free manufacturing processes.
Typical Applications
- High‑bandwidth networking — FPGA fabric, high I/O count and transceiver‑oriented architecture support packet processing, switching and protocol bridging.
- Telecommunications and datacom — large logic capacity and on‑chip memory enable implementation of complex protocol stacks and buffering for backplane and transport equipment.
- Video and broadcast processing — substantial embedded RAM and DSP resources support video frame buffering, real‑time processing and format conversion tasks.
- Industrial control and automation — industrial temperature grade and extensive I/O make the device suitable for motor control, sensor aggregation and deterministic control applications.
Unique Advantages
- High logic density: 531,200 logic elements allow integration of large subsystems on a single device, reducing component count and board complexity.
- Substantial on‑chip memory: approximately 28 Mbits of RAM minimizes dependence on external memory for many buffering and processing tasks.
- Extensive I/O: 880 I/Os enable broad connectivity to peripherals, memory interfaces and I/O‑heavy designs without multiple devices.
- Industrial temperature capability: −40 °C to 100 °C operation supports deployment in harsh or temperature‑variable environments.
- Compact, high‑density package: 1760‑FCBGA (42.5 × 42.5 mm) provides a dense footprint for space‑constrained, high‑performance PCBs.
- Family‑level features: Stratix IV GX device handbook references (DSP, PLLs, high‑speed transceivers, clock networks) provide a robust architectural foundation for high‑throughput designs.
Why Choose EP4SGX530KF43I4N?
The EP4SGX530KF43I4N targets designs that require a high degree of integration, substantial on‑chip memory and extensive I/O in an industrial‑grade FPGA. Its combination of 531,200 logic elements, approximately 28 Mbits of embedded RAM and 880 I/Os in a 1760‑FCBGA package delivers the capacity and board‑level efficiency needed for networking, telecom, video processing and industrial control systems.
For teams building scalable, performance‑focused systems, this Stratix IV GX device provides the architectural building blocks and environmental range to support long‑life deployments while simplifying BOM and system partitioning.
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