EP4SGX530KH40C2N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 28033024 531200 1517-BBGA, FCBGA |
|---|---|
| Quantity | 447 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530KH40C2N – Stratix® IV GX FPGA, 1517-BBGA FCBGA
The EP4SGX530KH40C2N is a Stratix IV GX Field Programmable Gate Array (FPGA) IC designed for commercial applications requiring large-scale programmable logic and dense I/O. This high-capacity FPGA integrates substantial logic resources, embedded memory, and a high pin-count package to address complex digital designs and multi-channel system integration.
With 531,200 logic elements, approximately 28 Mbits of on-chip RAM, and 744 I/O pins in a surface-mount 1517-BBGA (42.5 × 42.5 mm) package, the device targets applications that need significant integration while operating within standard commercial temperature and voltage ranges.
Key Features
- Core Logic 531,200 logic elements provide a large fabric for implementing complex state machines, custom accelerators, and wide parallel datapaths.
- Embedded Memory Approximately 28 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage that reduce dependence on external memory.
- I/O Density 744 I/O pins enable multi-channel interfaces, broad peripheral connectivity, and board-level consolidation of signals.
- Package and Mounting 1517-BBGA FCBGA surface-mount package (supplier package: 1517-HBGA, 42.5 × 42.5 mm) for high pin-count board designs.
- Power Core supply range of 870 mV to 930 mV to align with low-voltage FPGA power architectures.
- Operating Range and Grade Commercial grade with an operating temperature range of 0 °C to 85 °C for standard professional and industrial-adjacent applications.
- Compliance RoHS compliant to meet environmental and manufacturing requirements for lead-free assemblies.
Typical Applications
- High-density prototyping and FPGA-based proof-of-concept: Use the large logic and memory resources to validate complex digital architectures and system integration before production.
- Multi-protocol I/O bridging: Leverage 744 I/O pins to implement protocol conversion, aggregation, and board-level signal routing without extensive external logic.
- Data buffering and packet processing: On-chip RAM and abundant logic enable local packet buffering, queue management, and custom packet-handling pipelines.
- Custom accelerator and co-processor designs: Implement domain-specific accelerators or offload functions from a host processor using the available logic capacity and memory.
Unique Advantages
- High logic capacity: 531,200 logic elements allow implementation of large, complex designs without immediate partitioning across multiple devices.
- Substantial on-chip memory: Approximately 28 Mbits of embedded RAM reduces the need for external memory and simplifies board design for data-intensive functions.
- Extensive I/O integration: 744 I/O pins support dense interfacing to sensors, transceivers, and peripherals, helping to minimize external glue logic.
- Compact, high-pin-count package: The 1517-BBGA (1517-HBGA, 42.5 × 42.5 mm) footprint delivers large I/O and logic capacity in a single surface-mount package.
- Low-voltage core operation: 870–930 mV supply compatibility supports integration into modern low-voltage power architectures.
- RoHS compliance: Facilitates lead-free manufacturing and aligns with common environmental standards.
Why Choose EP4SGX530KH40C2N?
The EP4SGX530KH40C2N positions itself as a high-capacity, commercially graded FPGA for designers who need significant programmable logic, on-chip memory, and large I/O counts in a single device. Its combination of 531,200 logic elements, approximately 28 Mbits of embedded RAM, and 744 I/Os makes it well suited for complex digital systems, multi-channel interfaces, and FPGA-based acceleration within the 0 °C to 85 °C operating range.
Choose this Stratix IV GX device when your design requires consolidation of functions, reduced external component count, and a surface-mount, high-pin-count package that supports dense board-level integration while meeting RoHS requirements.
Request a quote or submit an inquiry to receive pricing and availability for EP4SGX530KH40C2N. Our team can assist with lead-time information and next steps for procurement.

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