EP4SGX530KH40C2N

IC FPGA 744 I/O 1517HBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 28033024 531200 1517-BBGA, FCBGA

Quantity 447 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-HBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SGX530KH40C2N – Stratix® IV GX FPGA, 1517-BBGA FCBGA

The EP4SGX530KH40C2N is a Stratix IV GX Field Programmable Gate Array (FPGA) IC designed for commercial applications requiring large-scale programmable logic and dense I/O. This high-capacity FPGA integrates substantial logic resources, embedded memory, and a high pin-count package to address complex digital designs and multi-channel system integration.

With 531,200 logic elements, approximately 28 Mbits of on-chip RAM, and 744 I/O pins in a surface-mount 1517-BBGA (42.5 × 42.5 mm) package, the device targets applications that need significant integration while operating within standard commercial temperature and voltage ranges.

Key Features

  • Core Logic  531,200 logic elements provide a large fabric for implementing complex state machines, custom accelerators, and wide parallel datapaths.
  • Embedded Memory  Approximately 28 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage that reduce dependence on external memory.
  • I/O Density  744 I/O pins enable multi-channel interfaces, broad peripheral connectivity, and board-level consolidation of signals.
  • Package and Mounting  1517-BBGA FCBGA surface-mount package (supplier package: 1517-HBGA, 42.5 × 42.5 mm) for high pin-count board designs.
  • Power  Core supply range of 870 mV to 930 mV to align with low-voltage FPGA power architectures.
  • Operating Range and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard professional and industrial-adjacent applications.
  • Compliance  RoHS compliant to meet environmental and manufacturing requirements for lead-free assemblies.

Typical Applications

  • High-density prototyping and FPGA-based proof-of-concept: Use the large logic and memory resources to validate complex digital architectures and system integration before production.
  • Multi-protocol I/O bridging: Leverage 744 I/O pins to implement protocol conversion, aggregation, and board-level signal routing without extensive external logic.
  • Data buffering and packet processing: On-chip RAM and abundant logic enable local packet buffering, queue management, and custom packet-handling pipelines.
  • Custom accelerator and co-processor designs: Implement domain-specific accelerators or offload functions from a host processor using the available logic capacity and memory.

Unique Advantages

  • High logic capacity: 531,200 logic elements allow implementation of large, complex designs without immediate partitioning across multiple devices.
  • Substantial on-chip memory: Approximately 28 Mbits of embedded RAM reduces the need for external memory and simplifies board design for data-intensive functions.
  • Extensive I/O integration: 744 I/O pins support dense interfacing to sensors, transceivers, and peripherals, helping to minimize external glue logic.
  • Compact, high-pin-count package: The 1517-BBGA (1517-HBGA, 42.5 × 42.5 mm) footprint delivers large I/O and logic capacity in a single surface-mount package.
  • Low-voltage core operation: 870–930 mV supply compatibility supports integration into modern low-voltage power architectures.
  • RoHS compliance: Facilitates lead-free manufacturing and aligns with common environmental standards.

Why Choose EP4SGX530KH40C2N?

The EP4SGX530KH40C2N positions itself as a high-capacity, commercially graded FPGA for designers who need significant programmable logic, on-chip memory, and large I/O counts in a single device. Its combination of 531,200 logic elements, approximately 28 Mbits of embedded RAM, and 744 I/Os makes it well suited for complex digital systems, multi-channel interfaces, and FPGA-based acceleration within the 0 °C to 85 °C operating range.

Choose this Stratix IV GX device when your design requires consolidation of functions, reduced external component count, and a surface-mount, high-pin-count package that supports dense board-level integration while meeting RoHS requirements.

Request a quote or submit an inquiry to receive pricing and availability for EP4SGX530KH40C2N. Our team can assist with lead-time information and next steps for procurement.

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