EP4SGX530KH40C2G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 438 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530KH40C2G – Field Programmable Gate Array (FPGA) IC
The EP4SGX530KH40C2G is a high-density FPGA device from the Stratix IV device family, designed for demanding, high-bandwidth digital designs. It combines a large programmable fabric with extensive I/O and on-chip memory to address applications that require significant logic capacity and system integration.
Targeted at communications, signal processing and system-integration applications, this device delivers a mix of configurable logic, embedded memory and I/O resources suitable for high-speed interfaces and complex data-paths.
Key Features
- Programmable Logic Capacity 531,200 logic elements provide substantial on-chip logic resources for complex designs and implementation of large custom datapaths.
- Embedded Memory Approximately 28 Mbits of embedded memory supports large buffering, on-chip data storage and local scratchpad requirements.
- I/O Density 744 I/O pins enable broad connectivity for parallel interfaces, board-level peripherals and high-pin-count systems.
- Stratix IV Architecture Described in the Stratix IV Device Handbook, the device family includes architecture features such as high-speed transceivers, DSP blocks and advanced clocking suitable for high-throughput designs.
- Package and Mounting Supplied in a 1517-HBGA (42.5×42.5 mm) FCBGA package for surface-mount assembly, facilitating high-density board layouts.
- Power and Voltage Core supply range specified at 870 mV to 930 mV to match system power-domain requirements.
- Operating Grade Commercial temperature range rated from 0 °C to 85 °C for standard embedded and industrial-adjacent applications.
- Compliance RoHS compliant to support modern manufacturing and environmental requirements.
Typical Applications
- High-Speed Networking Use the device's large logic capacity and high I/O count for packet processing, switch fabric and interface bridging in networking equipment.
- Digital Signal Processing Leverage the Stratix IV architecture and embedded memory for real-time DSP tasks, multi-channel data aggregation and algorithm acceleration.
- External Memory Interfaces Implement memory controllers and wide external-memory buses using the device’s architecture suited for external memory interfaces.
- Test & Measurement Systems Deploy the device for high-throughput data capture, protocol analysis and instrumentation where signal integrity and diagnostic features are important.
Unique Advantages
- High integration density: 531,200 logic elements and ~28 Mbits of embedded memory reduce the need for external logic and memory components, simplifying board-level design.
- Extensive I/O capability: 744 I/Os provide flexibility to connect wide buses, multiple peripherals and high-speed interfaces without additional bridge logic.
- Architecture optimized for bandwidth: Part of the Stratix IV family, the device supports high-speed transceivers and advanced clocking, enabling high aggregate data throughput.
- Production-ready package: The 1517-HBGA (42.5×42.5 mm) FCBGA package supports high-density, surface-mount manufacturing for compact system designs.
- Controlled power domain: Narrow core voltage window (870 mV–930 mV) allows predictable power budgeting in tightly regulated systems.
- Regulatory readiness: RoHS compliance aligns the device with current environmental manufacturing requirements.
Why Choose EP4SGX530KH40C2G?
The EP4SGX530KH40C2G positions itself as a high-capacity Stratix IV FPGA combining large programmable logic, substantial embedded memory and a high I/O count to address complex, bandwidth-intensive designs. Its package and electrical characteristics make it suitable for systems that demand dense integration and predictable power management.
This device is appropriate for engineering teams building high-throughput communications, DSP-accelerated or system-integration solutions that require scalable logic resources and extensive external interfacing while operating within a commercial temperature range.
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