EP4SGX530KH40C2G

IC FPGA 744 I/O 1517HBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 438 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-HBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SGX530KH40C2G – Field Programmable Gate Array (FPGA) IC

The EP4SGX530KH40C2G is a high-density FPGA device from the Stratix IV device family, designed for demanding, high-bandwidth digital designs. It combines a large programmable fabric with extensive I/O and on-chip memory to address applications that require significant logic capacity and system integration.

Targeted at communications, signal processing and system-integration applications, this device delivers a mix of configurable logic, embedded memory and I/O resources suitable for high-speed interfaces and complex data-paths.

Key Features

  • Programmable Logic Capacity  531,200 logic elements provide substantial on-chip logic resources for complex designs and implementation of large custom datapaths.
  • Embedded Memory  Approximately 28 Mbits of embedded memory supports large buffering, on-chip data storage and local scratchpad requirements.
  • I/O Density  744 I/O pins enable broad connectivity for parallel interfaces, board-level peripherals and high-pin-count systems.
  • Stratix IV Architecture  Described in the Stratix IV Device Handbook, the device family includes architecture features such as high-speed transceivers, DSP blocks and advanced clocking suitable for high-throughput designs.
  • Package and Mounting  Supplied in a 1517-HBGA (42.5×42.5 mm) FCBGA package for surface-mount assembly, facilitating high-density board layouts.
  • Power and Voltage  Core supply range specified at 870 mV to 930 mV to match system power-domain requirements.
  • Operating Grade  Commercial temperature range rated from 0 °C to 85 °C for standard embedded and industrial-adjacent applications.
  • Compliance  RoHS compliant to support modern manufacturing and environmental requirements.

Typical Applications

  • High-Speed Networking  Use the device's large logic capacity and high I/O count for packet processing, switch fabric and interface bridging in networking equipment.
  • Digital Signal Processing  Leverage the Stratix IV architecture and embedded memory for real-time DSP tasks, multi-channel data aggregation and algorithm acceleration.
  • External Memory Interfaces  Implement memory controllers and wide external-memory buses using the device’s architecture suited for external memory interfaces.
  • Test & Measurement Systems  Deploy the device for high-throughput data capture, protocol analysis and instrumentation where signal integrity and diagnostic features are important.

Unique Advantages

  • High integration density: 531,200 logic elements and ~28 Mbits of embedded memory reduce the need for external logic and memory components, simplifying board-level design.
  • Extensive I/O capability: 744 I/Os provide flexibility to connect wide buses, multiple peripherals and high-speed interfaces without additional bridge logic.
  • Architecture optimized for bandwidth: Part of the Stratix IV family, the device supports high-speed transceivers and advanced clocking, enabling high aggregate data throughput.
  • Production-ready package: The 1517-HBGA (42.5×42.5 mm) FCBGA package supports high-density, surface-mount manufacturing for compact system designs.
  • Controlled power domain: Narrow core voltage window (870 mV–930 mV) allows predictable power budgeting in tightly regulated systems.
  • Regulatory readiness: RoHS compliance aligns the device with current environmental manufacturing requirements.

Why Choose EP4SGX530KH40C2G?

The EP4SGX530KH40C2G positions itself as a high-capacity Stratix IV FPGA combining large programmable logic, substantial embedded memory and a high I/O count to address complex, bandwidth-intensive designs. Its package and electrical characteristics make it suitable for systems that demand dense integration and predictable power management.

This device is appropriate for engineering teams building high-throughput communications, DSP-accelerated or system-integration solutions that require scalable logic resources and extensive external interfacing while operating within a commercial temperature range.

Request a quote or submit an inquiry to receive pricing and availability information for the EP4SGX530KH40C2G.

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