EP4SGX530KH40C3

The EP4SGX530KH40C3 is a Stratix® IV GX Field Programmable Gate Array (FPGA) in a 1517-BBGA (FCBGA) package targeted for commercial applications. It provides a large programmable fabric with 531,200 logic elements and approximately 28 Mbits of embedded memory to handle demanding logic and on-chip buffering needs.

With 744 I/Os, a dedicated high-speed transceiver architecture, and support for DSP and external memory interfaces described in the Stratix IV family handbook, this device addresses high-bandwidth data processing, system integration, and advanced I/O requirements while operating from a low-voltage core (870–930 mV) in a surface-mount FCBGA footprint.

Key Features

• Core and Logic 531,200 logic elements (cells) and 21,248 LABs/CLBs available for large-scale programmable designs.
• Embedded Memory Approximately 28 Mbits of on-chip RAM to support buffering, packet storage, and intermediate data processing.
• DSP and Processing Resources Stratix IV family DSP block architecture is available for high-throughput arithmetic and signal-processing tasks as documented in the device handbook.
• I/O Capacity 744 total I/Os to support dense peripheral, memory, and interconnect requirements on complex boards.
• High-Speed Transceiver Architecture Stratix IV GX devices include high-speed transceiver features and support for a wide range of protocols as described in the family documentation.
• Power and Voltage Core operating supply range of 870 mV to 930 mV for the device core.
• Package and Mounting 1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (42.5×42.5). Surface-mount mounting type for board-level integration.
• Environmental and Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• High-bandwidth networking — Leverages the Stratix IV GX transceiver architecture and large logic capacity for packet processing and protocol handling.
• Data acquisition & processing — Large embedded memory and DSP resources enable real-time data aggregation and signal conditioning.
• Video and imaging systems — High I/O count and on-chip memory support frame buffering, interface aggregation, and image pipeline tasks.
• System integration and prototyping — Dense logic and I/O allow consolidation of multiple functions into a single FPGA for complex system designs.

Unique Advantages

• High logic density: 531,200 logic elements provide headroom for complex, multi-function designs and deep processing pipelines.
• Substantial embedded memory: Approximately 28 Mbits of on-chip RAM reduces dependence on external memory for many buffering and caching needs.
• Extensive I/O: 744 I/Os simplify board-level routing for interfaces, peripherals, and memory buses.
• Dedicated transceiver architecture: Stratix IV GX transceiver features enable support for high-speed serial protocols described in the device documentation.
• Compact FCBGA package: 1517-BBGA (supplier: 1517-HBGA, 42.5×42.5) surface-mount footprint supports dense PCB layouts.
• Commercial temperature and RoHS compliant: Designed for commercial deployments with RoHS compliance and a 0 °C to 85 °C operating range.

Why Choose EP4SGX530KH40C3?

The EP4SGX530KH40C3 combines a high-density Stratix IV GX fabric with extensive I/O, on-chip memory, and DSP resources to address large-scale, high-throughput FPGA designs. Its FCBGA package and surface-mount mounting make it suitable for compact, integrated system boards where consolidation of functionality is a priority.

This device is suited to teams building high-bandwidth data paths, complex signal-processing pipelines, and systems that require significant logic and I/O integration while operating within commercial temperature and voltage ranges. The Stratix IV family documentation provides additional architecture and transceiver details to support development and integration.

Request a quote or submit an inquiry to get pricing and availability for EP4SGX530KH40C3.