EP4SGX530KH40C3NES

The EP4SGX530KH40C3NES is a high-density Stratix® IV GX field programmable gate array (FPGA) designed for complex, programmable digital designs. It combines a large logic capacity with substantial on-chip RAM and a high I/O count to support applications that require significant integration and I/O bandwidth.

Packaged in a 1517-BBGA (1517-HBGA, 42.5 × 42.5 mm) surface-mount package and rated for commercial operation, this device delivers a compact solution for board-level FPGA implementations while meeting RoHS environmental requirements.

Key Features

• Core Logic  531,200 logic elements provide extensive programmable fabric for implementing large-scale digital logic, custom datapaths, and complex state machines.
• Embedded Memory  Approximately 28 Mbits of on-chip RAM (28,033,024 bits) for buffering, FIFOs, and memory-intensive functions without relying on external memory.
• I/O Capacity  744 user I/Os to support wide parallel interfaces, multiple peripheral connections, and high-pin-count system designs.
• Power Supply Range  Operates from 870 mV to 930 mV supply to match system power-rail requirements and enable predictable integration into power-managed platforms.
• Package & Mounting  1517-BBGA (1517-HBGA, 42.5 × 42.5 mm) FCBGA package with surface-mount mounting for compact board layouts and high-density PCB integration.
• Operating Conditions  Commercial grade operation over 0 °C to 85 °C, suitable for standard commercial electronics environments.
• Environmental Compliance  RoHS compliant to support lead-free manufacturing and regulatory requirements.

Typical Applications

• High-density programmable logic systems  Implements complex custom logic and large-scale state machines using the device’s 531,200 logic elements.
• I/O-intensive platforms  Supports designs that require many external connections or wide parallel interfaces with 744 available I/Os.
• Memory-heavy on-chip processing  Leverages approximately 28 Mbits of embedded RAM for buffering, packet storage, and temporary datasets.
• Board-level FPGA modules and prototypes  Surface-mount 1517-BBGA package enables compact board designs and evaluation modules.

Unique Advantages

• High logic density: 531,200 logic elements give designers the capacity to consolidate large portions of a system into a single FPGA, reducing external component count.
• Substantial on-chip memory: Approximately 28 Mbits of embedded RAM minimizes dependence on external memory for many buffering and data-processing tasks.
• Extensive I/O availability: 744 I/Os provide flexibility for interfacing with multiple peripherals, buses, and parallel data paths without additional multiplexing.
• Compact surface-mount package: 1517-HBGA (42.5 × 42.5 mm) package supports dense PCB layouts and saves board space compared to multi-chip solutions.
• Commercial-grade temperature range: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• RoHS compliant: Supports lead-free assembly and environmental compliance objectives.

Why Choose EP4SGX530KH40C3NES?

The EP4SGX530KH40C3NES positions itself as a high-capacity, highly integrated FPGA option for designs that demand large programmable logic resources, significant on-chip memory, and a high number of I/Os in a single package. Its surface-mount 1517-BBGA package and commercial operating range make it suitable for compact, board-level implementations where integration and I/O count are priorities.

This device is a practical choice for engineering teams looking to consolidate multiple functions into one FPGA, reduce BOM complexity, and leverage substantial embedded RAM for on-chip data handling, all while maintaining RoHS compliance and standard commercial temperature operation.

Request a quote or submit an inquiry to discuss pricing, availability, and lead times for the EP4SGX530KH40C3NES. Our team can provide the information you need to evaluate this FPGA for your design.