EP4SGX530KH40I3

The EP4SGX530KH40I3 is a Stratix® IV GX Field Programmable Gate Array (FPGA) from Intel, provided in a 1517-BBGA FCBGA package. It delivers a high-density programmable logic fabric with a large embedded memory resource and a substantial I/O count for industrial-grade designs.

This device targets applications that require extensive logic capacity, on-chip RAM and broad connectivity within an industrial operating range, offering designers the flexibility to implement complex, high-performance digital systems.

Key Features

• Logic Capacity  531,200 logic elements for implementing large-scale, custom digital designs.
• Logic Array Blocks (LABs)  21,248 LABs/CLBs to structure and organize programmable logic resources.
• Embedded Memory  Approximately 28 Mbits of total on-chip RAM to support buffering, FIFOs and local data storage.
• I/O Density  744 single-ended I/O pins to support wide parallel interfaces and multiple external connections.
• Power  Core voltage supply range of 870 mV–930 mV for the device core.
• Package & Mounting  1517-BBGA FCBGA package, supplier device package 1517-HBGA (42.5 × 42.5 mm), designed for surface-mount assembly.
• Temperature & Grade  Industrial grade device specified for operation from −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant for regulated material requirements.

Typical Applications

• Industrial Control Systems  Use the large logic capacity and industrial operating range to implement real-time control, sequencing and custom state machines in harsh environments.
• High-density Signal Processing  Leverage the extensive logic elements and approximately 28 Mbits of on-chip RAM for data buffering, DSP pipelines and custom processing blocks.
• Networking & Communications  The high I/O count and large programmable fabric enable wide-parallel interfaces, protocol bridges and custom packet processing.

Unique Advantages

• High Logic Integration: 531,200 logic elements allow consolidation of complex subsystems into a single device, reducing board-level component count.
• Significant Embedded Memory: Approximately 28 Mbits of on-chip RAM supports deep buffering and local data storage without external memory.
• Extensive External Connectivity: 744 I/Os provide flexibility for parallel buses, multiple interfaces and I/O-rich designs.
• Industrial-grade Operating Range: Specified from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact FCBGA Package: 1517-BBGA (1517-HBGA supplier package, 42.5 × 42.5 mm) supports high-density board integration with surface-mount assembly.
• Regulatory Compliance: RoHS compliant to meet environmental material restrictions.

Why Choose EP4SGX530KH40I3?

The EP4SGX530KH40I3 combines a very large logic element count, substantial on-chip RAM and a high I/O density in an industrial-grade FPGA package. It is well suited for designs that require extensive programmable logic, local memory resources and robust operation across a wide temperature range.

Engineers and procurement teams looking to consolidate system functions, reduce BOM complexity and deploy scalable, long-lived designs will find this Intel Stratix® IV GX device a compelling option for demanding industrial and high-density digital applications.

Request a quote or submit an inquiry to check availability and pricing for the EP4SGX530KH40I3.