EP4SGX530KH40I3N

The EP4SGX530KH40I3N is a Stratix® IV GX Field Programmable Gate Array from Intel, offering a high-density programmable logic platform in an FCBGA surface-mount package. It delivers a combination of large logic capacity, substantial embedded memory, and a high I/O count for complex digital designs.

With 531,200 logic elements, approximately 28 Mbits of on-chip RAM, and 744 I/O pins, this industrial-grade device supports applications that require extensive logic integration and broad external interfacing while operating across a wide temperature range.

Key Features

• Core / Logic Capacity  531,200 logic elements to implement large-scale custom logic and parallel architectures.
• Embedded Memory  Approximately 28 Mbits of on-chip RAM (28,033,024 bits) for buffering, FIFOs, and local data storage.
• High I/O Count  744 user I/O pins provide extensive connectivity to external devices and interfaces.
• Power / Voltage  Core voltage supply range of 870 mV to 930 mV to match low-voltage system rails.
• Package & Mounting  1517-BBGA FCBGA package (supplier device package: 1517-HBGA, 42.5 × 42.5 mm) with surface-mount mounting for board-level integration.
• Operating Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density custom logic  Implement complex, large-scale digital functions using 531,200 logic elements and substantial embedded RAM.
• I/O-intensive systems  Designs that require broad external connectivity can leverage 744 I/O pins for interfacing with peripherals and subsystems.
• Industrial control and instrumentation  Industrial-grade temperature range (−40 °C to 100 °C) supports deployment in temperature-demanding environments.
• Low-voltage system designs  Core supply range of 870–930 mV aligns with modern low-voltage architectures and power budgets.

Unique Advantages

• High logic density: 531,200 logic elements enable implementation of complex algorithms and high levels of parallelism.
• Significant on-chip memory: Approximately 28 Mbits of embedded RAM reduce dependence on external memory for buffering and local data storage.
• Extensive external connectivity: 744 I/O pins provide flexibility for connecting many peripherals, sensors, and memory interfaces.
• Industrial temperature capability: Rated from −40 °C to 100 °C to meet the needs of temperature-demanding deployments.
• Low-voltage core operation: 870–930 mV supply range supports modern low-voltage system designs.
• FCBGA surface-mount packaging: 1517-BBGA (supplier 1517-HBGA, 42.5 × 42.5 mm) supports high pin count and board-level integration.

Why Choose EP4SGX530KH40I3N?

The EP4SGX530KH40I3N positions itself as a high-capacity, industrial-grade Stratix® IV GX FPGA that combines hundreds of thousands of logic elements, multi-megabit on-chip RAM, and a large I/O complement in a compact FCBGA package. It is aimed at designs that demand substantial programmable logic resources, significant embedded memory, and broad external interfacing while maintaining industrial temperature operation.

As an Intel Stratix IV GX device, it provides a platform for engineers who need high-density programmable logic integrated with ample on-chip resources and robust package options for surface-mount assembly.

Request a quote or submit a quote request for EP4SGX530KH40I3N to receive pricing and availability information tailored to your project needs.