EP4SGX530KH40I4N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 28033024 531200 1517-BBGA, FCBGA |
|---|---|
| Quantity | 882 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530KH40I4N – Stratix® IV GX FPGA, 531,200 logic elements, 744 I/O
The EP4SGX530KH40I4N is a Stratix® IV GX field programmable gate array (FPGA) IC from Intel, offering a high-density logic fabric suitable for complex, I/O‑intensive designs. With 531,200 logic elements and approximately 28 Mbits of embedded memory, this device targets applications that require significant on-chip logic and storage capacity within an industrial temperature range.
Designed for surface-mount deployment in a 1517-BBGA/FCBGA package (supplier device package: 1517-HBGA, 42.5 × 42.5 mm), the device combines dense I/O capability with low-voltage core operation for board-level integration in demanding environments.
Key Features
- High Logic Density 531,200 logic elements provide a large FPGA fabric for implementing complex logic, parallel algorithms, and large custom architectures.
- Embedded Memory Approximately 28 Mbits of on-chip RAM support sizable data buffering, lookup tables, and state storage without external memory dependency.
- Extensive I/O 744 I/O pins enable dense external interfacing for multi-channel data acquisition, control buses, and high-pin-count peripherals.
- Low-Voltage Core Specified core voltage range of 870 mV to 930 mV supports low-voltage power architectures and efficient on-board power delivery.
- Robust Packaging and Mounting Surface-mount 1517-BBGA (FCBGA) package with supplier package dimensions 42.5 × 42.5 mm for compact, high-density PCB layouts.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial deployment where extended temperature tolerance is required.
- Environmentally Compliant RoHS compliant to meet regulatory requirements for lead-free assembly.
Typical Applications
- High-Density Signal Processing Use the large logic element count and embedded memory to implement parallel processing, DSP pipelines, and custom accelerators.
- Multi-Channel Communications Extensive I/O enables interfacing to numerous transceivers, PHYs, and protocol converters for communications and networking equipment.
- Industrial Control and Automation Industrial-grade temperature rating and robust I/O support control systems, motion control, and industrial protocol bridging in harsh environments.
- Complex Prototyping and System Integration High logic and memory resources let design teams integrate multiple functions onto a single FPGA for prototyping and consolidation of board-level components.
Unique Advantages
- Highly Integrated Logic Capacity: 531,200 logic elements enable consolidation of complex subsystems and reduce the need for multiple discrete devices.
- Substantial On-Chip Memory: Approximately 28 Mbits of embedded RAM reduces external memory requirements and improves data throughput within the FPGA.
- Very High I/O Density: 744 I/O pins provide flexibility for dense peripheral connectivity and multi-channel interfaces.
- Industrial‑Grade Operation: Specified −40 °C to 100 °C operating range supports deployment in temperature-challenging industrial environments.
- Low-Voltage Core Compatibility: 870 mV to 930 mV supply range aligns with modern power architectures for efficient board-level power design.
- Surface-Mount BGA Packaging: 1517-BBGA/1517-HBGA packaging supports compact, high-density PCB layouts for space-constrained systems.
Why Choose EP4SGX530KH40I4N?
The EP4SGX530KH40I4N positions itself as a high-capacity, industrial-grade FPGA well suited to designers who need large logic resources, significant on-chip memory, and substantial I/O in a compact surface-mount package. Its operating voltage and temperature specifications make it a practical choice for systems that demand efficient power delivery and reliable operation across a broad temperature range.
Ideal for engineering teams working on high-performance signal processing, communications, and industrial control systems, this Stratix® IV GX device delivers the integration and deterministic resources necessary to consolidate functions and streamline board-level designs while maintaining regulatory compliance for lead-free assembly.
Request a quote for EP4SGX530KH40I4N or submit an RFQ to obtain pricing and availability information tailored to your project requirements.

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