EP4SGX530KH40I4N

IC FPGA 744 I/O 1517HBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 28033024 531200 1517-BBGA, FCBGA

Quantity 882 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-HBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SGX530KH40I4N – Stratix® IV GX FPGA, 531,200 logic elements, 744 I/O

The EP4SGX530KH40I4N is a Stratix® IV GX field programmable gate array (FPGA) IC from Intel, offering a high-density logic fabric suitable for complex, I/O‑intensive designs. With 531,200 logic elements and approximately 28 Mbits of embedded memory, this device targets applications that require significant on-chip logic and storage capacity within an industrial temperature range.

Designed for surface-mount deployment in a 1517-BBGA/FCBGA package (supplier device package: 1517-HBGA, 42.5 × 42.5 mm), the device combines dense I/O capability with low-voltage core operation for board-level integration in demanding environments.

Key Features

  • High Logic Density  531,200 logic elements provide a large FPGA fabric for implementing complex logic, parallel algorithms, and large custom architectures.
  • Embedded Memory  Approximately 28 Mbits of on-chip RAM support sizable data buffering, lookup tables, and state storage without external memory dependency.
  • Extensive I/O  744 I/O pins enable dense external interfacing for multi-channel data acquisition, control buses, and high-pin-count peripherals.
  • Low-Voltage Core  Specified core voltage range of 870 mV to 930 mV supports low-voltage power architectures and efficient on-board power delivery.
  • Robust Packaging and Mounting  Surface-mount 1517-BBGA (FCBGA) package with supplier package dimensions 42.5 × 42.5 mm for compact, high-density PCB layouts.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial deployment where extended temperature tolerance is required.
  • Environmentally Compliant  RoHS compliant to meet regulatory requirements for lead-free assembly.

Typical Applications

  • High-Density Signal Processing  Use the large logic element count and embedded memory to implement parallel processing, DSP pipelines, and custom accelerators.
  • Multi-Channel Communications  Extensive I/O enables interfacing to numerous transceivers, PHYs, and protocol converters for communications and networking equipment.
  • Industrial Control and Automation  Industrial-grade temperature rating and robust I/O support control systems, motion control, and industrial protocol bridging in harsh environments.
  • Complex Prototyping and System Integration  High logic and memory resources let design teams integrate multiple functions onto a single FPGA for prototyping and consolidation of board-level components.

Unique Advantages

  • Highly Integrated Logic Capacity: 531,200 logic elements enable consolidation of complex subsystems and reduce the need for multiple discrete devices.
  • Substantial On-Chip Memory: Approximately 28 Mbits of embedded RAM reduces external memory requirements and improves data throughput within the FPGA.
  • Very High I/O Density: 744 I/O pins provide flexibility for dense peripheral connectivity and multi-channel interfaces.
  • Industrial‑Grade Operation: Specified −40 °C to 100 °C operating range supports deployment in temperature-challenging industrial environments.
  • Low-Voltage Core Compatibility: 870 mV to 930 mV supply range aligns with modern power architectures for efficient board-level power design.
  • Surface-Mount BGA Packaging: 1517-BBGA/1517-HBGA packaging supports compact, high-density PCB layouts for space-constrained systems.

Why Choose EP4SGX530KH40I4N?

The EP4SGX530KH40I4N positions itself as a high-capacity, industrial-grade FPGA well suited to designers who need large logic resources, significant on-chip memory, and substantial I/O in a compact surface-mount package. Its operating voltage and temperature specifications make it a practical choice for systems that demand efficient power delivery and reliable operation across a broad temperature range.

Ideal for engineering teams working on high-performance signal processing, communications, and industrial control systems, this Stratix® IV GX device delivers the integration and deterministic resources necessary to consolidate functions and streamline board-level designs while maintaining regulatory compliance for lead-free assembly.

Request a quote for EP4SGX530KH40I4N or submit an RFQ to obtain pricing and availability information tailored to your project requirements.

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