EP4SGX530NF45C2G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,014 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 920 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530NF45C2G – Field Programmable Gate Array (FPGA) IC
The EP4SGX530NF45C2G is an Intel Stratix IV–family FPGA IC delivering a large programmable fabric for high-density digital designs. It combines a high logic-element count, abundant on-chip memory, and extensive I/O to address complex data processing and connectivity tasks.
Designed for commercial applications, this device targets projects requiring significant logic capacity, rich I/O resources, and configurable architecture building blocks drawn from the Stratix IV device family.
Key Features
- Logic Capacity — 531,200 logic elements provide substantial programmable fabric for dense logic implementations and complex state machines.
- Embedded Memory — Approximately 28.03 Mbits of embedded memory to support buffering, packet storage, or on-chip data structures.
- I/O Density — 920 I/O pins for broad external connectivity and flexible board-level interfacing options.
- Stratix IV Architecture Features — Includes the Stratix IV family feature set such as DSP blocks, clock networks, PLLs, and architecture elements documented in the Stratix IV device handbook.
- High‑Speed Transceiver and I/O Features — Family-level support for high-speed transceiver functionality and high-speed differential I/O features (including DPA and Soft‑CDR) as described in the Stratix IV device documentation.
- External Memory Interfaces — Architecture-level support for external memory interfaces to enable broad memory subsystem options.
- Power Supply — Core voltage specification of 870 mV to 930 mV for device operation.
- Package & Mounting — Available in a 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type.
- Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant.
Typical Applications
- High‑performance data processing — Large logic capacity and embedded memory enable on-chip acceleration and real-time data manipulation tasks.
- Communications and connectivity systems — Stratix IV transceiver and high‑speed differential I/O features, combined with extensive I/O count, support protocol and link implementations.
- Memory‑interface subsystems — Embedded memory and architecture support for external memory interfaces make the device suitable for designs requiring significant buffering or caching.
Unique Advantages
- High logic density: 531,200 logic elements let you consolidate complex functions into a single device and reduce inter-chip routing.
- Significant on‑chip storage: Approximately 28.03 Mbits of embedded memory reduces external memory dependence and lowers system BOM complexity.
- Extensive I/O: 920 I/O pins provide flexibility for multi-channel interfaces and diverse peripheral integration.
- Stratix IV family feature set: Architecture-level DSP blocks, PLLs, and clock networks support sophisticated timing, signal processing, and system integration strategies.
- Commercial readiness: RoHS compliance and a defined 0 °C to 85 °C operating range make the device appropriate for commercial-grade deployments.
- Flexible packaging: 1932-BBGA / 1932-FBGA packaging and surface-mount mounting simplify high-density board designs.
Why Choose EP4SGX530NF45C2G?
The EP4SGX530NF45C2G pairs a high logic-element count with substantial embedded memory and wide I/O bandwidth drawn from the Stratix IV device family, offering a consolidated platform for complex, high-throughput digital systems. Its architecture features—DSP resources, clocking infrastructure, and documented transceiver/I/O capabilities—help engineers implement demanding data-paths and interface-rich designs within a single commercial‑grade FPGA.
This device is well suited for teams needing scalability in logic and memory resources, flexible interfacing, and established architecture-level capabilities documented in the Stratix IV device handbook. Its packaging, electrical, and environmental specs make it straightforward to evaluate for commercial applications requiring robust programmable logic performance.
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