EP4SGX530NF45C3N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 920 28033024 531200 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,363 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 920 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530NF45C3N – Stratix IV GX FPGA, 531,200 logic elements, 920 I/O
The EP4SGX530NF45C3N is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC in a 1932-BBGA (FCBGA) package designed for high-density, high-bandwidth system designs. It combines a large logic fabric with substantial embedded memory and a high pin count to support complex, performance-oriented implementations.
Device documentation for the Stratix IV family highlights integrated transceiver performance, DSP resources, TriMatrix memory blocks and comprehensive clock and PLL resources, making this device suitable for designs that require advanced serial interfaces and on-chip processing capabilities.
Key Features
- Core Logic 531,200 logic elements provide a large programmable fabric for complex digital functions and custom hardware acceleration.
- Embedded Memory Approximately 28 Mbits of on-chip RAM (28,033,024 total RAM bits) for buffering, look-up tables, and local storage.
- I/O and Packaging 920 user I/O pins in a 1932-BBGA, FCBGA package (supplier package: 1932-FBGA, FC 45×45) with surface-mount mounting for high-density board layouts.
- High-speed Interfaces and DSP Series documentation includes transceiver performance and DSP block specifications, indicating integrated resources for serial data and signal processing tasks.
- Clocking and Timing Device handbook sections cover PLL specifications and clock tree capabilities to support complex timing and multi-clock designs.
- Power and Operating Conditions Core supply voltage range 870 mV to 930 mV; commercial-grade operating temperature 0 °C to 85 °C.
- System Features Family documentation includes configuration and JTAG specifications, chip-wide reset and temperature sensing diode references for system integration.
- Environmental Compliance RoHS compliant.
Typical Applications
- High-speed serial communications On-chip transceiver resources and abundant I/O support multi-lane serial links and protocol implementations.
- DSP and signal processing Integrated DSP block specifications and large embedded memory make the device suitable for on‑chip filtering, modulation, and real-time processing tasks.
- Custom hardware acceleration High logic element count and substantial local RAM enable implementation of accelerators for compute‑intensive workloads.
- Large-scale prototyping and system integration Dense I/O and a compact FCBGA package support complex board-level integration and multi-function prototypes.
Unique Advantages
- High logic density: 531,200 logic elements deliver capacity for large, integrated designs without partitioning across multiple devices.
- Significant on-chip memory: Approximately 28 Mbits of embedded RAM reduces external memory dependence and improves data locality.
- Extensive I/O in a compact package: 920 I/O pins in a 1932-BBGA FCBGA package allow dense connectivity while keeping PCB footprint manageable.
- Integrated high-speed and DSP resources: Transceiver and DSP block specifications in the device handbook provide the building blocks for serial interfaces and signal-processing functions.
- Designed for system integration: Documentation for PLLs, configuration, JTAG and reset resources supports predictable integration into complex systems.
- Commercial operating range and RoHS compliance: Commercial-grade temperature range (0 °C to 85 °C) and RoHS compliance simplify regulatory and environmental considerations for many applications.
Why Choose EP4SGX530NF45C3N?
The EP4SGX530NF45C3N positions itself as a high-capacity Stratix IV GX FPGA option for designs that require a combination of large logic resources, substantial embedded memory, and extensive I/O in a single device. Its documented transceiver, DSP and clocking features support implementations that need on-chip serial interfaces and advanced signal processing.
This device is suited to engineering teams building high-performance communications, signal processing, and custom accelerator solutions who require a dense, integrated FPGA with clear operating and power parameters and comprehensive device-level documentation for system integration.
Request a quote or submit a product inquiry to check pricing and availability for the EP4SGX530NF45C3N.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018