EP4SGX530NF45C3N

IC FPGA 920 I/O 1932FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 920 28033024 531200 1932-BBGA, FCBGA

Quantity 1,363 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O920Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits28033024

Overview of EP4SGX530NF45C3N – Stratix IV GX FPGA, 531,200 logic elements, 920 I/O

The EP4SGX530NF45C3N is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC in a 1932-BBGA (FCBGA) package designed for high-density, high-bandwidth system designs. It combines a large logic fabric with substantial embedded memory and a high pin count to support complex, performance-oriented implementations.

Device documentation for the Stratix IV family highlights integrated transceiver performance, DSP resources, TriMatrix memory blocks and comprehensive clock and PLL resources, making this device suitable for designs that require advanced serial interfaces and on-chip processing capabilities.

Key Features

  • Core Logic  531,200 logic elements provide a large programmable fabric for complex digital functions and custom hardware acceleration.
  • Embedded Memory  Approximately 28 Mbits of on-chip RAM (28,033,024 total RAM bits) for buffering, look-up tables, and local storage.
  • I/O and Packaging  920 user I/O pins in a 1932-BBGA, FCBGA package (supplier package: 1932-FBGA, FC 45×45) with surface-mount mounting for high-density board layouts.
  • High-speed Interfaces and DSP  Series documentation includes transceiver performance and DSP block specifications, indicating integrated resources for serial data and signal processing tasks.
  • Clocking and Timing  Device handbook sections cover PLL specifications and clock tree capabilities to support complex timing and multi-clock designs.
  • Power and Operating Conditions  Core supply voltage range 870 mV to 930 mV; commercial-grade operating temperature 0 °C to 85 °C.
  • System Features  Family documentation includes configuration and JTAG specifications, chip-wide reset and temperature sensing diode references for system integration.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • High-speed serial communications  On-chip transceiver resources and abundant I/O support multi-lane serial links and protocol implementations.
  • DSP and signal processing  Integrated DSP block specifications and large embedded memory make the device suitable for on‑chip filtering, modulation, and real-time processing tasks.
  • Custom hardware acceleration  High logic element count and substantial local RAM enable implementation of accelerators for compute‑intensive workloads.
  • Large-scale prototyping and system integration  Dense I/O and a compact FCBGA package support complex board-level integration and multi-function prototypes.

Unique Advantages

  • High logic density: 531,200 logic elements deliver capacity for large, integrated designs without partitioning across multiple devices.
  • Significant on-chip memory: Approximately 28 Mbits of embedded RAM reduces external memory dependence and improves data locality.
  • Extensive I/O in a compact package: 920 I/O pins in a 1932-BBGA FCBGA package allow dense connectivity while keeping PCB footprint manageable.
  • Integrated high-speed and DSP resources: Transceiver and DSP block specifications in the device handbook provide the building blocks for serial interfaces and signal-processing functions.
  • Designed for system integration: Documentation for PLLs, configuration, JTAG and reset resources supports predictable integration into complex systems.
  • Commercial operating range and RoHS compliance: Commercial-grade temperature range (0 °C to 85 °C) and RoHS compliance simplify regulatory and environmental considerations for many applications.

Why Choose EP4SGX530NF45C3N?

The EP4SGX530NF45C3N positions itself as a high-capacity Stratix IV GX FPGA option for designs that require a combination of large logic resources, substantial embedded memory, and extensive I/O in a single device. Its documented transceiver, DSP and clocking features support implementations that need on-chip serial interfaces and advanced signal processing.

This device is suited to engineering teams building high-performance communications, signal processing, and custom accelerator solutions who require a dense, integrated FPGA with clear operating and power parameters and comprehensive device-level documentation for system integration.

Request a quote or submit a product inquiry to check pricing and availability for the EP4SGX530NF45C3N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up