EP4SGX530NF45C4N

The EP4SGX530NF45C4N is a Stratix® IV GX field programmable gate array (FPGA) IC offering a high density of programmable logic and on-chip memory in a compact FCBGA package. With 531,200 logic elements, approximately 28.0 Mbits of embedded RAM and 920 I/Os, the device addresses designs that require significant logic capacity and extensive connectivity.

Designed for commercial-grade deployments, the device operates over a 0 °C to 85 °C temperature range, uses a core supply voltage between 870 mV and 930 mV, and is RoHS compliant.

Key Features

• Core Logic Capacity  531,200 logic elements provide substantial programmable resources for complex digital functions.
• Embedded Memory  Approximately 28.0 Mbits of on-chip RAM for buffering, state storage and local data processing.
• I/O Resources  920 user I/Os to support high-pin-count interfacing and flexible system connectivity.
• Package & Mounting  1932-BBGA (FCBGA) package with supplier device package 1932-FBGA, FC (45×45); surface-mount mounting for board-level integration.
• Power  Core voltage supply range from 870 mV to 930 mV; design must account for specified supply range.
• Temperature & Grade  Commercial-grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to support regulatory requirements.

Typical Applications

• High-density programmable logic systems  Consolidate complex digital functions using the device's large logic capacity.
• I/O-intensive interface hubs  Leverage 920 I/Os for multiport connectivity, sensor interfaces and high-pin-count subsystems.
• Memory-centric buffering and processing  Use the approximately 28.0 Mbits of embedded RAM for data buffering and local processing tasks.

Unique Advantages

• Large on-chip logic density: 531,200 logic elements enable consolidation of multiple functions into a single FPGA, reducing system component count.
• Substantial embedded memory: Approximately 28.0 Mbits of RAM reduces reliance on external memory for many applications.
• Extensive I/O availability: 920 I/Os provide flexibility for complex interconnect and interface requirements.
• Compact FCBGA package: 1932-BBGA (45×45) package supports high-density board layouts while maintaining a surface-mount footprint.
• Commercial-grade operation: 0 °C to 85 °C rating aligns with standard commercial electronics environments.
• RoHS compliant: Meets environmental manufacturing requirements for lead-free production.

Why Choose EP4SGX530NF45C4N?

The EP4SGX530NF45C4N combines a very large logic fabric, significant on-chip memory and a high I/O count in a compact 1932-BBGA FCBGA package, making it well suited for dense, I/O-rich FPGA designs that must operate within commercial temperature ranges. As a Stratix® IV GX device, it delivers integration and resource capacity appropriate for complex programmable implementations.

This device is appropriate for engineering teams and procurement looking for a high-density FPGA option with substantial embedded memory and broad connectivity, offering design consolidation and a reduced board-level BOM where those attributes align with project requirements.

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