EP4SGX530NF45C4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 762 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 920 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530NF45C4G – Field Programmable Gate Array (FPGA) IC
The EP4SGX530NF45C4G is a commercial-grade FPGA from Intel, referenced within the Stratix IV device family. It delivers a large programmable fabric with extensive embedded memory and I/O resources targeted at high‑bandwidth system designs and complex logic integration.
Architected for applications that require significant logic capacity, substantial on‑chip RAM, and comprehensive I/O, this device is described in the Stratix IV Device Handbook, which highlights architecture features such as high‑speed transceivers, DSP resources, PLLs, and advanced I/O support.
Key Features
- Programmable Fabric: 531,200 logic elements providing extensive capacity for complex designs and integration of custom logic functions.
- Embedded Memory: Approximately 28 Mbits of embedded memory to support buffering, high‑throughput data paths, and on‑chip storage for application logic.
- I/O Density: 920 I/O pins to support broad peripheral connectivity and multiple high‑pin‑count interfaces.
- Stratix IV Series Architecture: Device handbook references architecture features including high‑speed transceivers, DSP blocks, PLLs, and extensive I/O capabilities for protocol support and high aggregate bandwidth.
- Package & Mounting: Available in a 1932‑BBGA / FCBGA package (1932‑FBGA, FC 45×45) with surface‑mount mounting for compact, high‑density board integration.
- Power Supply: Core voltage supply range of 870 mV to 930 mV for the device core power domain.
- Operating Environment: Commercial temperature grade with an operating range of 0 °C to 85 °C and RoHS compliance.
Typical Applications
- High‑Bandwidth Networking & Telecom: Use the device’s Stratix IV architecture and referenced high‑speed transceiver features to implement protocol interfaces and aggregate data paths.
- Video & Broadcast Processing: Leverage the large logic element count and substantial on‑chip memory for real‑time video pipelines, buffering and format conversions.
- Signal Processing & Acceleration: Utilize embedded memory and the device family’s DSP and PLL resources (as referenced in the device handbook) for custom signal processing and hardware acceleration tasks.
- System Prototyping & Integration: High I/O count and dense package options support board‑level prototyping and integration of complex subsystems with multiple external interfaces.
Unique Advantages
- Large Programmable Capacity: 531,200 logic elements enable consolidation of multiple functions into a single device, reducing system complexity and board count.
- Substantial On‑Chip Memory: Approximately 28 Mbits of embedded RAM supports high‑throughput data buffering and local storage for performance‑sensitive designs.
- High I/O Count: 920 I/Os provide flexibility to connect numerous peripherals and external interfaces without multiplexing compromises.
- Family‑Level Features: As part of the Stratix IV device family (documented in the Stratix IV Device Handbook), the device benefits from architecture features such as high‑speed transceivers, DSP resources and advanced clocking described in the handbook.
- Compact Packaging: 1932‑FBGA (45×45) package in a surface‑mount form factor supports high‑density board designs while simplifying assembly.
- Commercial‑Grade Reliability: Commercial operating range (0 °C to 85 °C) and RoHS compliance align the device with mainstream electronic product requirements.
Why Choose EP4SGX530NF45C4G?
The EP4SGX530NF45C4G positions itself as a high‑capacity, commercially graded FPGA solution within the Stratix IV family, combining a large number of logic elements, significant embedded memory, and extensive I/O capability for demanding system designs. Its documented family features—including high‑speed transceiver support and DSP/clocking resources—make it suitable for designs that require integrated high‑throughput processing and flexible interface support.
This device is appropriate for teams building high‑bandwidth communications equipment, advanced signal processing subsystems, or complex prototype platforms that need a scalable, well‑documented FPGA fabric backed by Intel’s Stratix IV device documentation.
Request a quote or submit an inquiry to obtain pricing, availability, and more detailed technical support information for EP4SGX530NF45C4G.

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