EP4SGX530NF45C2N

The EP4SGX530NF45C2N is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC from Intel. It provides a high-density programmable logic platform with 531,200 logic elements and approximately 28 Mbits of embedded memory for complex digital implementations.

Packaged in a 1932-BBGA (FCBGA) 45×45 surface-mount package, the device offers 920 I/O pins, operates from a 0.870–0.930 V supply range, and is specified for commercial-grade operation from 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• High-density logic: 531,200 logic elements to implement large-scale, customizable digital functions.
• Embedded memory: Approximately 28 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic.
• Extensive I/O: 920 I/O pins for broad connectivity and flexible interfacing to external devices and subsystems.
• Package and mounting: 1932-BBGA (FCBGA) 45×45 supplier device package in a surface-mount format for compact, high-pin-count board designs.
• Power: Supported core voltage range of 870 mV to 930 mV to match target power architectures.
• Operating range: Commercial temperature grade specified from 0 °C to 85 °C.
• Compliance: RoHS compliant, meeting common environmental restrictions for electronic assemblies.

Typical Applications

• High-density digital processing: Use the large logic element count and embedded memory for complex signal processing and algorithm acceleration.
• I/O-intensive systems: Applications requiring many external interfaces can leverage the device’s 920 I/O pins for broad connectivity.
• Compact, high-pin-count boards: The 1932-BBGA FCBGA 45×45 package supports dense board layouts where space and pin count are critical.
• Commercial electronic products: Designed for commercial-grade deployments with a 0 °C to 85 °C operating range and RoHS compliance.

Unique Advantages

• Highly integrated programmable logic: 531,200 logic elements reduce external glue logic and consolidate system functions on a single device.
• Substantial embedded memory: Approximately 28 Mbits of on-chip RAM supports large buffers and complex state machines without external SRAM.
• Massive I/O capacity: 920 I/O pins enable extensive peripheral and bus interfacing, minimizing the need for external multiplexing.
• Space-efficient package: 1932-BBGA (FCBGA) 45×45 delivers high pin density in a surface-mount form factor suitable for compact designs.
• Commercial-ready specification: 0 °C to 85 °C operating range and RoHS compliance align with standard commercial product requirements.
• Manufacturer backing: Offered by Intel as part of the Stratix IV GX family, providing a clear product pedigree for design planning.

Why Choose EP4SGX530NF45C2N?

The EP4SGX530NF45C2N combines substantial programmable logic capacity, significant on-chip memory, and a very high I/O count in a compact 1932-BBGA surface-mount package. These attributes make it a strong fit for designs that require dense logic integration, extensive interfacing, and embedded memory without relying on many external components.

As a commercial-grade Stratix IV GX FPGA from Intel, it delivers a balance of performance, integration, and compliance that supports scalable designs and long-term deployment in commercial electronic products.

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