EP4SGX530KH40I4G

IC FPGA 744 I/O 1517HBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,279 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-HBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits28033024

Overview of EP4SGX530KH40I4G – Field Programmable Gate Array (FPGA) IC

The EP4SGX530KH40I4G is a Stratix IV family Field Programmable Gate Array (FPGA) device from Intel. It delivers a large programmable fabric with substantial on‑chip memory and extensive I/O capability intended for high‑bandwidth digital designs and system integration tasks.

Designed for industrial applications, this device targets use cases that require dense logic capacity, significant embedded RAM, and flexible I/O in a 1517‑ball BGA package while operating across a wide temperature and low‑voltage core range.

Key Features

  • Core Logic  531,200 logic elements (cells) provide a large programmable fabric for complex digital logic, state machines, and custom accelerators.
  • Embedded Memory  Approximately 28 Mbits of on‑chip RAM to support buffering, packet processing, and intermediate data storage.
  • I/O Capacity  744 general I/O pins to support broad interface requirements and dense board connectivity.
  • Package & Mounting  1517‑ball FCBGA (supplier package: 1517‑HBGA, 42.5 × 42.5 mm) in a surface‑mount form factor for compact system integration.
  • Power  Core voltage supply range of 870 mV to 930 mV to match low‑voltage system power rails.
  • Operating Range  Industrial temperature range from −40 °C to 100 °C suitable for demanding environments.
  • Series Features (Stratix IV family)  Architecture elements referenced in the device handbook include high‑speed transceiver support, digital signal processing blocks, PLLs and advanced clock networks, and wide protocol support for high aggregate bandwidth systems.
  • Compliance  RoHS‑compliant manufacturing status.

Typical Applications

  • Telecommunications & Networking  High logic density and extensive I/O support packet processing, high‑speed protocol handling, and interface aggregation.
  • Signal Processing & DSP Accelerators  Large embedded memory and the Stratix IV family’s DSP architecture are suited for filtering, FFTs, and real‑time data manipulation.
  • Instrumentation & Test Equipment  Dense logic, substantial on‑chip RAM, and broad I/O enable measurement, capture, and complex control functions in lab and production test systems.
  • Video & Broadcast Processing  High aggregate data bandwidth and on‑chip resources make the device appropriate for multi‑channel video processing and format conversion tasks.

Unique Advantages

  • High Logic Capacity: 531,200 logic elements allow implementation of large, multi‑function designs without partitioning across multiple devices.
  • Significant On‑Chip Memory: Approximately 28 Mbits of embedded RAM reduces dependence on external memory for buffering and real‑time processing.
  • Extensive I/O Count: 744 I/O pins provide flexibility for rich peripheral interfaces and high‑pin‑count system connections.
  • Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
  • Compact BGA Package: 1517‑ball FCBGA (42.5 × 42.5 mm) balances high integration density with manufacturable surface‑mount assembly.
  • Low‑Voltage Core Operation: 870–930 mV supply compatibility for low‑power system designs and modern power distribution schemes.

Why Choose EP4SGX530KH40I4G?

The EP4SGX530KH40I4G combines a very large programmable fabric with substantial embedded memory and broad I/O to address complex, high‑bandwidth system designs. Its industrial temperature rating and RoHS compliance make it suitable for robust, long‑lifecycle applications that demand reliability and integration.

This device is well suited for engineering teams building telecommunications, signal processing, instrumentation, or high‑throughput media applications that require scalable logic resources, on‑chip memory, and flexible interfacing in a compact BGA package.

If you would like pricing or availability information for EP4SGX530KH40I4G, request a quote or submit an inquiry to receive a formal quote and delivery lead‑time details.

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