EP4SGX530KH40I3G

IC FPGA 744 I/O 1517HBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,803 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-HBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21248Number of Logic Elements/Cells531200
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits28033024

Overview of EP4SGX530KH40I3G – Field Programmable Gate Array (FPGA) IC

The EP4SGX530KH40I3G is an Intel Stratix IV–family Field Programmable Gate Array supplied in a 1517-ball FCBGA package. It provides a large programmable fabric combined with substantial embedded memory and a high I/O count for demanding system designs in industrial environments.

Designed for high-throughput logic and system integration tasks, the device targets applications that require extensive logic resources, significant on-chip RAM, and broad I/O connectivity while operating across an industrial temperature range.

Key Features

  • Logic Capacity  531,200 logic elements providing a large programmable fabric for complex logic, control, and computational functions.
  • Embedded Memory  Approximately 28 Mbits of embedded memory (28,033,024 total RAM bits) for on-chip buffering, look-up tables, and intermediate data storage.
  • I/O Resources  744 user I/O pins to support diverse peripheral interfaces, wide bus widths, and multiple external device connections.
  • Package and Mounting  1517-ball FCBGA package (supplier package: 1517-HBGA, 42.5 × 42.5 mm) in a surface-mount form factor suitable for compact, board-level integration.
  • Power Supply  Core supply range of 870 mV to 930 mV for the FPGA core power domain as specified.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, supporting deployment in industrial temperature environments.
  • Series Features (Stratix IV)  Series-level capabilities documented in the Stratix IV Device Handbook such as advanced FPGA architecture, high-speed transceiver features, DSP resources, PLLs, and comprehensive clock networks.
  • Compliance  RoHS compliant.

Typical Applications

  • High-speed data processing  Hardware-accelerated signal and packet processing that benefit from large logic capacity and extensive embedded memory.
  • Telecommunications and networking  Protocol handling and high-throughput I/O aggregation leveraging the device’s high I/O count and Stratix IV family transceiver and interface capabilities.
  • Instrumentation and test equipment  Custom timing, control, and data acquisition functions that require deterministic logic resources and industrial temperature operation.
  • Video and imaging pipelines  Parallel processing and buffering operations made possible by the large logic fabric and on-chip memory.

Unique Advantages

  • Large programmable fabric: 531,200 logic elements enable complex custom logic, large state machines, and parallel datapaths without external ASICs.
  • Substantial on-chip memory: Approximately 28 Mbits of embedded RAM reduces external memory dependence for buffering and intermediate storage.
  • High I/O density: 744 I/O pins provide flexibility to interface with wide buses, multiple peripherals, and high-pin-count daughtercards.
  • Industrial operating range: Specified −40 °C to 100 °C operation supports deployments in industrial temperature environments.
  • Compact, board-ready package: 1517-ball FCBGA (42.5 × 42.5 mm) surface-mount package simplifies PCB layout for dense system designs.
  • Stratix IV family resources: Availability of series-level documentation and architectural features from the Stratix IV Device Handbook to support system-level design choices.

Why Choose EP4SGX530KH40I3G?

The EP4SGX530KH40I3G combines a very large logic element count with substantial embedded memory and a high I/O complement in a robust industrial-temperature, surface-mount package. It is well suited for engineers building complex, high-throughput systems that need on-chip resources to minimize external components and simplify board-level integration.

For designs that require scalability in logic, memory, and I/O while leveraging the architectural features described for the Stratix IV family, this device offers a balance of integration and deployment readiness for industrial applications.

Request a quote or submit a request for pricing and availability to move your design forward with the EP4SGX530KH40I3G.

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