EP4SGX530KH40I3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,803 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21248 | Number of Logic Elements/Cells | 531200 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 28033024 |
Overview of EP4SGX530KH40I3G – Field Programmable Gate Array (FPGA) IC
The EP4SGX530KH40I3G is an Intel Stratix IV–family Field Programmable Gate Array supplied in a 1517-ball FCBGA package. It provides a large programmable fabric combined with substantial embedded memory and a high I/O count for demanding system designs in industrial environments.
Designed for high-throughput logic and system integration tasks, the device targets applications that require extensive logic resources, significant on-chip RAM, and broad I/O connectivity while operating across an industrial temperature range.
Key Features
- Logic Capacity 531,200 logic elements providing a large programmable fabric for complex logic, control, and computational functions.
- Embedded Memory Approximately 28 Mbits of embedded memory (28,033,024 total RAM bits) for on-chip buffering, look-up tables, and intermediate data storage.
- I/O Resources 744 user I/O pins to support diverse peripheral interfaces, wide bus widths, and multiple external device connections.
- Package and Mounting 1517-ball FCBGA package (supplier package: 1517-HBGA, 42.5 × 42.5 mm) in a surface-mount form factor suitable for compact, board-level integration.
- Power Supply Core supply range of 870 mV to 930 mV for the FPGA core power domain as specified.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, supporting deployment in industrial temperature environments.
- Series Features (Stratix IV) Series-level capabilities documented in the Stratix IV Device Handbook such as advanced FPGA architecture, high-speed transceiver features, DSP resources, PLLs, and comprehensive clock networks.
- Compliance RoHS compliant.
Typical Applications
- High-speed data processing Hardware-accelerated signal and packet processing that benefit from large logic capacity and extensive embedded memory.
- Telecommunications and networking Protocol handling and high-throughput I/O aggregation leveraging the device’s high I/O count and Stratix IV family transceiver and interface capabilities.
- Instrumentation and test equipment Custom timing, control, and data acquisition functions that require deterministic logic resources and industrial temperature operation.
- Video and imaging pipelines Parallel processing and buffering operations made possible by the large logic fabric and on-chip memory.
Unique Advantages
- Large programmable fabric: 531,200 logic elements enable complex custom logic, large state machines, and parallel datapaths without external ASICs.
- Substantial on-chip memory: Approximately 28 Mbits of embedded RAM reduces external memory dependence for buffering and intermediate storage.
- High I/O density: 744 I/O pins provide flexibility to interface with wide buses, multiple peripherals, and high-pin-count daughtercards.
- Industrial operating range: Specified −40 °C to 100 °C operation supports deployments in industrial temperature environments.
- Compact, board-ready package: 1517-ball FCBGA (42.5 × 42.5 mm) surface-mount package simplifies PCB layout for dense system designs.
- Stratix IV family resources: Availability of series-level documentation and architectural features from the Stratix IV Device Handbook to support system-level design choices.
Why Choose EP4SGX530KH40I3G?
The EP4SGX530KH40I3G combines a very large logic element count with substantial embedded memory and a high I/O complement in a robust industrial-temperature, surface-mount package. It is well suited for engineers building complex, high-throughput systems that need on-chip resources to minimize external components and simplify board-level integration.
For designs that require scalability in logic, memory, and I/O while leveraging the architectural features described for the Stratix IV family, this device offers a balance of integration and deployment readiness for industrial applications.
Request a quote or submit a request for pricing and availability to move your design forward with the EP4SGX530KH40I3G.

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